11. Kada a sanya abubuwan da suka dace da damuwa a sasanninta, gefuna, ko kusa da masu haɗawa, ramukan hawa, ramuka, yankewa, gashes da sasanninta na bugu na allunan kewayawa.Waɗannan wuraren wurare ne masu yawan damuwa na allon da'irar da aka buga, waɗanda ke iya haifar da tsagewa ko fashe cikin haɗin gwiwa da abubuwan haɗin gwiwa cikin sauƙi.
12. The layout na aka gyara zai hadu da tsari da kuma tazara bukatun na reflow soldering da igiyar ruwa soldering.Yana rage tasirin inuwa yayin sayar da igiyar ruwa.
13. Ya kamata a ajiye ramukan daftarin da'ira da aka buga da kuma kafaffen tallafi don mamaye matsayin.
14. A cikin zane na babban yanki buga allon kewaye fiye da 500cm2, Domin hana buguwar da'irar daga lanƙwasa lokacin ƙetare tanderun tin, ya kamata a bar rata na 5 ~ 10mm fadi a tsakiyar allon da aka buga, kuma abubuwan da aka gyara (za su iya tafiya) kada a sanya su, don haka kamar yadda don hana buguwar allon da'ira daga lankwasa lokacin ƙetare tanderun gwangwani.
15. The bangaren layout shugabanci na reflow soldering tsari.
(1) Jagoran shimfidar wuri na sassan ya kamata yayi la'akari da jagorancin allon da'irar da aka buga a cikin tanderun da aka sake fitarwa.
(2) domin yin biyu karshen guntu aka gyara a bangarorin biyu na weld karshen da SMD aka gyara a bangarorin biyu na fil aiki tare ne mai tsanani, rage aka gyara a bangarorin biyu na waldi karshen ba ya samar da erection, matsawa. , synchronous zafi daga waldi lahani kamar solder waldi karshen, bukatar biyu karshen guntu aka gyara a kan buga kewaye hukumar dogon axis ya zama perpendicular ga shugabanci na conveyor bel na reflow tanda.
(3) Dogon axis na abubuwan SMD yakamata ya kasance daidai da hanyar canja wurin tanderun da aka sake fitarwa.Tsawon tsayin daka na abubuwan CHIP da tsayin tsayin sassan SMD a ƙarshen duka yakamata su kasance daidai da juna.
(4) Kyakkyawan shimfidar shimfidar wuri na sassan ya kamata ba kawai la'akari da daidaituwar ƙarfin zafi ba, amma kuma la'akari da jagora da jerin abubuwan da aka gyara.
(5) Don babban girman bugu na allon kewayawa, don kiyaye zafin jiki a ɓangarorin biyu na allon da'irar da aka buga daidai gwargwadon yuwuwar, tsayin gefen da'irar da aka buga ya kamata ya kasance daidai da jagorancin bel mai ɗaukar nauyi na reflow. tanderu.Don haka, lokacin da girman allon da aka buga ya fi girma fiye da 200mm, buƙatun sune kamar haka:
(A) Dogon axis na sashin CHIP a ƙarshen duka yana tsaye zuwa gefen tsayin allon da aka buga.
(B) Dogon axis na bangaren SMD yana layi daya da dogon gefen allon da'ira da aka buga.
(C) Don allon da'irar da aka buga a bangarorin biyu, abubuwan da ke bangarorin biyu suna da daidaito iri ɗaya.
(D) Shirya alkiblar abubuwan da aka gyara akan allon da'ira da aka buga.Kamata ya yi a tsara makamantan abubuwan da aka tsara a cikin hanya guda gwargwadon iyawa, kuma halayen halayen ya kamata su kasance iri ɗaya, don sauƙaƙe shigarwa, waldawa da gano abubuwan.Idan electrolytic capacitor tabbatacce iyakacin duniya, diode tabbatacce iyakacin duniya, transistor guda fil ƙarshen, fil na farko na hadedde tsarin tsarin da'irar daidai gwargwado gwargwadon yiwuwa.
16. Domin hana gajeren kewaye tsakanin yadudduka lalacewa ta hanyar taba da buga waya a lokacin PCB aiki, da conductive juna Layer na ciki da kuma m Layer ya kamata fiye da 1.25mm daga PCB gefen.Lokacin da aka sanya waya ta ƙasa a gefen PCB na waje, wayar ƙasa zata iya mamaye matsayin gefen.Domin PCB saman matsayi da aka shagaltar da saboda tsarin bukatun, sassa da kuma buga conductors kada a sanya a underside solder kushin yankin na SMD/SMC ba tare da ramukan, don kauce wa karkatar da solder bayan an mai tsanani da remelted a cikin kalaman. soldering bayan reflow soldering.
17. Tazarar shigarwa na abubuwan da aka gyara: Matsakaicin tazarar shigarwa na abubuwan da aka gyara dole ne ya dace da buƙatun taron SMT don ƙira, gwaji, da kiyayewa.
Lokacin aikawa: Dec-21-2020