Babban marufi shine ɗayan manyan abubuwan fasaha na zamanin 'Fiye da Moore'.Kamar yadda kwakwalwan kwamfuta ke ƙara zama mai wahala da tsada don ƙarawa a kowane kumburin tsari, injiniyoyi suna sanya kwakwalwan kwamfuta da yawa a cikin fakitin ci gaba ta yadda ba za su ƙara yin gwagwarmayar rage su ba.Wannan labarin yana ba da taƙaitaccen gabatarwa ga 10 daga cikin mafi yawan kalmomin da ake amfani da su a cikin fasahar marufi.
2.5D fakiti
Kunshin 2.5D ci gaba ne na fasahar marufi na 2D na gargajiya na IC, yana ba da damar layin mafi kyau da amfani da sarari.A cikin fakitin 2.5D, an jera matattun mutuwar ko kuma a sanya su gefe-da-gefe a saman Layer interposer tare da silicon vias (TSVs).Tushen, ko interposer Layer, yana ba da haɗin kai tsakanin kwakwalwan kwamfuta.
Fakitin 2.5D galibi ana amfani da shi don manyan ASICs, FPGAs, GPUs da cubes ƙwaƙwalwar ajiya.2008 ya ga Xilinx ya raba manyan FPGAs zuwa ƙananan kwakwalwan kwamfuta guda huɗu tare da mafi girman yawan amfanin ƙasa kuma ya haɗa waɗannan zuwa Layer interposer na silicon.Don haka an haifi fakitin 2.5D kuma a ƙarshe sun zama masu amfani da yawa don haɓaka ƙwaƙwalwar ƙwaƙwalwar ajiya mai girma (HBM).
Tsarin fakitin 2.5D
3D marufi
A cikin fakitin IC na 3D, ana tattara ma'anar mutuwa tare ko tare da mutun ajiya, yana kawar da buƙatar gina manyan Tsarin-kan-Chips (SoCs).Matattu suna haɗuwa da juna ta hanyar mai aiki mai aiki, yayin da fakitin 2.5D IC suna amfani da bumps ko TSVs don tara abubuwan da aka gyara akan layin interposer, fakitin 3D IC suna haɗa nau'ikan yadudduka na silicon wafers zuwa sassa ta amfani da TSVs.
Fasahar TSV ita ce mabuɗin damar fasaha a cikin fakitin 2.5D da 3D IC, kuma masana'antar semiconductor tana amfani da fasahar HBM don samar da kwakwalwan kwamfuta na DRAM a cikin fakitin 3D IC.
Duban sashe na fakitin 3D yana nuna cewa haɗin kai tsaye tsakanin guntun siliki yana samuwa ta hanyar ƙarfe na ƙarfe TSVs.
Chiplet
Chiplets wani nau'i ne na marufi na 3D IC wanda ke ba da damar haɗin kai iri-iri na CMOS da abubuwan da ba CMOS ba.A wasu kalmomi, ƙananan SoCs ne, kuma ana kiran su chiplets, maimakon manyan SoCs a cikin fakiti.
Rarraba babban SoC zuwa ƙarami, ƙananan kwakwalwan kwamfuta suna ba da mafi girma yawan amfanin ƙasa da ƙananan farashi fiye da mutuwar dandali guda ɗaya.chiplets suna ƙyale masu zanen kaya su yi amfani da fa'idar IP da yawa ba tare da yin la'akari da wace kullin tsari don amfani da wace fasaha za ta yi amfani da ita don ƙera ta ba.Za su iya amfani da abubuwa da yawa, ciki har da silicon, gilashi da laminates don ƙirƙirar guntu.
Tsarin tushen Chiplet an yi su ne da Chiplets da yawa akan Layer na tsaka-tsaki
Fakitin Fan Out
A cikin fakitin Fan Out, “haɗin” ana nisa daga saman guntu don samar da ƙarin I/O na waje.Yana amfani da kayan gyare-gyaren epoxy (EMC) wanda ke cike da cikawa a cikin mutu, yana kawar da buƙatar matakai kamar bumping wafer, fluxing, flip-chip hawa, tsaftacewa, fesa ƙasa da warkewa.Sabili da haka, ba a buƙatar wani Layer na tsaka-tsaki ko dai, yana sa haɗin kai iri-iri ya fi sauƙi.
Fasahar fan-out tana ba da ƙaramin kunshin tare da ƙarin I/O fiye da sauran nau'ikan fakiti, kuma a cikin 2016 tauraruwar fasaha ce lokacin da Apple ya sami damar yin amfani da fasahar marufi na TSMC don haɗa na'urar sarrafa aikace-aikacen 16nm da DRAM ta wayar hannu cikin fakiti ɗaya don iPhone. 7.
Marufi-fita
Kunshin matakin Wafer-Out (FOWLP)
Fasahar FOWLP haɓaka ce akan marufi-matakin wafer (WLP) wanda ke ba da ƙarin haɗin waje don guntun silicon.Ya haɗa da haɗa guntu a cikin kayan gyare-gyaren epoxy sannan gina babban babban redistribution Layer (RDL) akan saman wafer da yin amfani da ƙwallayen solder don samar da wafer da aka sake ginawa.
FOWLP yana ba da adadi mai yawa na haɗin kai tsakanin kunshin da allon aikace-aikacen, kuma saboda ma'aunin ya fi girma fiye da mutu, ƙirar mutu a zahiri ya fi annashuwa.
Misalin fakitin FOWLP
Haɗin kai iri-iri
Haɗuwa da nau'ikan nau'ikan daban-daban waɗanda aka kera daban a cikin manyan majalisai masu girma na iya haɓaka aiki da haɓaka halayen aiki, don haka masana'antun kayan aikin semiconductor suna iya haɗa kayan aikin aiki tare da tsari daban-daban yana gudana cikin taro ɗaya.
Haɗin kai iri-iri yana kama da tsarin-in-package (SiP), amma maimakon haɗuwa da mutuwar tsiraici da yawa akan madauri ɗaya, yana haɗa IPs da yawa a cikin nau'in Chiplets akan madauri ɗaya.Babban ra'ayin haɗin kai iri-iri shine haɗa abubuwa da yawa tare da ayyuka daban-daban a cikin fakiti ɗaya.
Wasu tubalan ginin fasaha a cikin haɗin kai iri-iri
HBM
HBM daidaitaccen fasahar ajiyar kaya ne wanda ke ba da manyan tashoshi na bandwidth don bayanai a cikin tari da tsakanin ƙwaƙwalwar ajiya da abubuwan ma'ana.Fakitin HBM suna tara ƙwaƙwalwar ajiya suna mutu kuma suna haɗa su tare ta TSV don ƙirƙirar ƙarin I/O da bandwidth.
HBM ma'aunin JEDEC ne wanda ke haɗa nau'ikan abubuwan DRAM da yawa a cikin fakiti, tare da na'urori masu sarrafa aikace-aikace, GPUs da SoCs.Ana aiwatar da HBM da farko azaman kunshin 2.5D don manyan sabobin sabobin da guntuwar sadarwar.Sakin HBM2 yanzu yana magance iyawa da iyakokin ƙimar agogo na farkon sakin HBM.
HBM kunshin
Matsakaicin Layer
Layin interposer shine magudanar ruwa ta inda ake ratsa siginonin lantarki daga ɗimbin guntu bare mutu ko allo a cikin kunshin.Ita ce hanyar sadarwa ta lantarki tsakanin kwasfa ko masu haɗin kai, tana ba da damar watsa siginar nesa da kuma haɗa su zuwa wasu kwasfa a kan allo.
The interposer Layer za a iya yi da silicon da Organic kayan da kuma aiki a matsayin gada tsakanin Multi-mutu mutu da allon.Silicon interposer yadudduka fasaha ce da aka tabbatar tare da babban girman girman girman I / O da ƙarfin samuwar TSV kuma suna taka muhimmiyar rawa a cikin 2.5D da 3D IC guntu marufi.
Aiwatar da al'ada na tsarin rabe matsakaici Layer
Layer sake rarrabawa
Layer na sake rarrabawa ya ƙunshi haɗin jan ƙarfe ko daidaitawa waɗanda ke ba da damar haɗin wutar lantarki tsakanin sassa daban-daban na kunshin.Layer ne na ƙarfe ko polymeric dielectric abu wanda za'a iya tarawa a cikin kunshin tare da mutuwa, don haka rage tazarar I/O na manyan kwakwalwan kwamfuta.Sake rarraba yadudduka sun zama wani muhimmin ɓangare na 2.5D da 3D mafita mafita, kyale kwakwalwan kwamfuta a kansu don sadarwa tare da juna ta amfani da tsaka-tsakin yadudduka.
Haɗe-haɗen fakiti ta amfani da yaduddukan sake rarrabawa
TSV
TSV shine fasahar aiwatar da maɓalli don 2.5D da mafita na marufi na 3D kuma wafer ce mai cike da tagulla wacce ke ba da haɗin kai tsaye ta hanyar siliki wafer mutu.Yana gudana cikin duka mutu don samar da haɗin lantarki, yana samar da mafi guntu hanya daga wannan gefen mutu zuwa wancan.
Ramuka ko ramuka ana lissafta su zuwa wani zurfin zurfin daga gefen gaba na wafer, wanda sai a keɓe shi kuma a cika shi ta hanyar ajiye kayan aiki (yawanci jan ƙarfe).Da zarar an ƙirƙira guntu, sai a yi bakin ciki daga gefen baya na wafer don fallasa vias da ƙarfen da aka ajiye a gefen baya na wafer don kammala haɗin gwiwar TSV.
Lokacin aikawa: Jul-07-2023