Gudun Tsarin Marufi na BGA

Substrate ko matsakaici Layer wani muhimmin bangare ne na kunshin BGA, wanda za'a iya amfani dashi don sarrafa impedance da haɗin inductor/resistor/ capacitor ban da haɗin haɗin kai.Saboda haka, da substrate abu da ake bukata don samun high gilashin mika mulki zazzabi rS (game da 175 ~ 230 ℃), high girma da kwanciyar hankali da kuma low danshi sha, mai kyau lantarki yi da high AMINCI.Fim ɗin ƙarfe, rufin rufi da kafofin watsa labarai ya kamata su kasance suna da manyan abubuwan mannewa tsakanin su.

1. Tsarin marufi na gubar bonded PBGA

① Shiri na PBGA substrate

Laminate madaidaicin bakin ciki (kauri 12 ~ 18μm) foil na jan karfe a ɓangarorin biyu na BT resin/glass core board, sa'an nan kuma haƙora ramuka da haɓaka ta hanyar rami.Ana amfani da tsarin PCB na al'ada tare da tsari na 3232 don ƙirƙirar zane-zane a ɓangarorin biyu na ma'auni, kamar su raƙuman jagora, na'urorin lantarki, da jeri na yanki don hawa ƙwallan solder.Sa'an nan kuma ana ƙara abin rufe fuska kuma an ƙirƙiri zane-zane don fallasa na'urorin lantarki da wuraren siyarwa.Don haɓaka haɓakar samarwa, ƙaramin abu yawanci yana ƙunshe da abubuwa masu yawa na PBG.

② Gudun Tsarin Marufi

Wafer thinning → Wafer yankan → guntu bonding → plasma tsaftacewa → gubar bonding → plasma tsaftacewa → molded kunshin → taro na solder bukukuwa → reflow soldering → surface marking → rabuwa → karshe dubawa → gwajin hopper marufi

Chip bonding yana amfani da mannen epoxy mai cike da azurfa don haɗa guntu IC zuwa madaidaicin, sannan ana amfani da haɗin waya na gwal don gane alaƙar guntu da ma'aunin, sannan ta hanyar ƙera filastik encapsulation ko tukunyar manne ruwa don kare guntu, layin solder. da pads.Ana amfani da kayan aiki na musamman da aka ƙera don sanya ƙwallayen solder 62/36/2Sn/Pb/Ag ko 63/37/Sn/Pb tare da wurin narkewa na 183°C da diamita na mil 30 (0.75mm) akan pads, da reflow soldering ana yin su a cikin tanda na al'ada, tare da matsakaicin zafin jiki na aiki wanda bai wuce 230 ° C ba.Sa'an nan kuma ana tsabtace substrate ta centrifugally tare da CFC inorganic cleaner don cire solder da fiber barbashi da aka bari a kan kunshin, biye da alama, rabuwa, dubawa na ƙarshe, gwaji, da marufi don ajiya.Abin da ke sama shine tsarin marufi na nau'in haɗin gubar PBGA.

2. Marufi tsari na FC-CBGA

① Ceramic substrate

Substrate na FC-CBGA shine yumbu mai yumbu mai yawa, wanda ke da wahalar yin shi.Domin da substrate yana da babban wayoyi yawa, kunkuntar tazara, kuma da yawa ta ramuka, kazalika da ake bukata na coplanarity na substrate ne high.Babban tsarinsa shine: da farko, ana yin amfani da zanen yumbu mai yawa a cikin babban zafin jiki don samar da yumbu mai ƙarfe da ƙarfe, sa'an nan kuma ana yin wiring ɗin ƙarfe na ƙarfe a kan substrate, sannan ana yin plating, da sauransu. A cikin taron CBGA , Rashin daidaituwa na CTE tsakanin substrate da guntu da kuma PCB kwamitin shine babban abin da ke haifar da gazawar samfuran CBGA.Don inganta wannan yanayin, ban da tsarin CCGA, ana iya amfani da wani nau'in yumbu mai yumbu, HITCE yumbura.

②Tsarin aiwatar da marufi

Shirye-shiryen diski bumps -> yankan diski -> guntu flip-flop da reflow soldering -> kasa cika na thermal man shafawa, rarraba sealing solder -> capping -> taro na solder bukukuwa -> reflow soldering -> marking -> rabuwa -> dubawa na ƙarshe -> gwaji -> marufi

3. Tsarin marufi na TBGA mai haɗa gubar

① TBGA mai ɗaukar hoto

Tef ɗin ɗaukar hoto na TBGA yawanci ana yin shi da kayan polyimide.

A cikin kera, bangarorin biyu na tef ɗin na farko an rufe su da tagulla, sa'an nan kuma a sanya nickel da zinariya plated, sannan a binne ta cikin rami da ƙarfe ta hanyar rami da samar da hotuna.Domin a cikin wannan gubar da ke da alaƙa da TBGA, ƙwanƙwan zafin jiki wanda aka lulluɓe shi ne maɗaukaki tare da ƙarfi da kuma ainihin rami na harsashi na bututu, don haka tef ɗin mai ɗaukar hoto yana ɗaure ga magudanar zafi ta amfani da manne mai matsa lamba kafin rufewa.

② Tsarin aiwatar da encapsulation

Chip thinning → Yanke guntu → haɗakar guntu → tsaftacewa → haɗakar gubar → Plasma tsaftacewa → Liquid sealant potting → taro na solder balls → reflow soldering → alamar saman → rabuwa → dubawa na ƙarshe → gwaji → marufi

Zhejiang NeoDen Technology Co., LTD., An kafa shi a cikin 2010, ƙwararrun masana'anta ne na ƙwararrun na'ura na SMT da na'ura, tanda mai sake fitarwa, injin bugu na stencil, layin samar da SMT da sauran samfuran SMT.

Mun yi imanin cewa manyan mutane da abokan haɗin gwiwa suna sa NeoDen ya zama babban kamfani kuma ƙaddamar da mu ga Innovation, Diversity da Dorewa yana tabbatar da cewa SMT aiki da kai yana samun dama ga kowane mai sha'awar sha'awa a ko'ina.

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