Abubuwan Bukatun Tsare-tsaren Tsare-tsare na Wutar Wuta da Rarraba Zafi

1. Yanayin zafi mai zafi, kauri da yanki na zane

Dangane da buƙatun ƙirar thermal na abubuwan da ake buƙata na zubar da zafi ya kamata a yi la’akari da su sosai, dole ne a tabbatar da cewa yanayin junction na abubuwan da ke haifar da zafi, zafin jiki na PCB don saduwa da buƙatun ƙirar samfur.

2. Heat nutse hawa surface roughness zane

Domin thermal kula da bukatun na high zafi samar da aka gyara, da zafi nutse da aka gyara na hawa surface roughness ya kamata a ba da garantin kai 3.2µm ko ma 1.6µm, ya kara da lamba yankin na karfe surface, yin cikakken amfani da high thermal watsin. daga cikin halayen kayan ƙarfe, don rage girman juriya na thermal lamba.Amma gabaɗaya, bai kamata a buƙaci roughness da yawa ba.

3. Zabin kayan cikawa

Domin rage thermal juriya na lamba surface na high-ikon bangaren hawa surface da zafi nutse, da dubawa rufi da thermal conductivity kayan, thermal conductivity filler kayan da high thermal watsin ya kamata a zaba, misali, rufi da thermal watsin. kayan kamar beryllium oxide (ko aluminum trioxide) yumbu takardar, polyimide fim, mica takardar, filler kayan kamar thermally conductive silicone man shafawa, daya-bangare vulcanized silicone roba, biyu-bangaren thermally conductive silicone roba, thermally conductive silicone roba kushin.

4. Shigarwa lamba surface

Shigarwa ba tare da rufi ba: kayan haɓaka kayan aiki → zafi mai ɗorewa → PCB, farfajiyar lamba biyu.
Insulated shigarwa: bangaren hawa surface → zafi nutse hawa surface → rufi Layer → PCB (ko chassis harsashi), uku yadudduka na lamba surface.Insulation Layer shigar a cikin abin da matakin, ya kamata a dogara a kan bangaren hawa surface ko PCB surface lantarki rufi bukatun.