1. BGA
Nunin lamba na ƙwallon ƙwallon ƙafa, ɗaya daga cikin fakitin nau'in dutsen saman.Ana yin bumps ɗin ƙwallon ƙafa a bayan abin da aka buga don maye gurbin fil ɗin daidai da hanyar nuni, kuma guntuwar LSI ana haɗa su a gaban ɓangaren bugu sannan a rufe shi da resin da aka ƙera ko hanyar tukunya.Wannan kuma ana kiransa mai ɗaukar bump nuni (PAC).Fil na iya wuce 200 kuma nau'in kunshin ne da ake amfani da shi don LSIs masu yawa.Hakanan za'a iya sanya jikin fakitin ƙasa da QFP (kunshin flat pin quad side pin).Misali, BGA mai 360-pin tare da cibiyoyin fil 1.5mm murabba'in 31mm ne kawai, yayin da QFP mai 304-pin tare da cibiyoyin fil 0.5mm shine murabba'in 40mm.Kuma BGA ba dole ba ne ta damu da nakasar fil kamar QFP.Kamfanin Motorola da ke Amurka ne ya kirkiro wannan kunshin kuma an fara amfani da shi ne a cikin na’urori irin su wayoyin hannu, kuma mai yiwuwa nan gaba ya shahara a Amurka ga kwamfutoci masu zaman kansu.Da farko, nisan tsakiya na fil (bump) na BGA shine 1.5mm kuma adadin fil shine 225. 500-pin BGA kuma wasu masana'antun LSI suna haɓakawa.Matsalar BGA ita ce dubawar bayyanar bayan sake kwarara.
2. BQFP (kunshin lebur quad tare da bumper)
Fakitin lebur quad tare da bumper, ɗaya daga cikin fakitin QFP, yana da bumps (bumper) a kusurwoyi huɗu na jikin kunshin don hana lankwasa fil yayin jigilar kaya.Masu masana'antun na'urorin lantarki na Amurka suna amfani da wannan kunshin galibi a cikin da'irori kamar microprocessors da ASICs.Nisan tsakiya 0.635mm, adadin fil daga 84 zuwa 196 ko makamancin haka.
3. Bump solder PGA(butt hadin gwiwa fil grid tsararru) Alaƙa na surface Dutsen PGA.
4. C (ceramic)
Alamar kunshin yumbu.Misali, CDIP na nufin yumbu DIP, wanda galibi ana amfani dashi a aikace.
5. Karfi
Fakitin layi na yumbu biyu an rufe shi da gilashi, ana amfani da shi don ECL RAM, DSP (Mai sarrafa siginar dijital) da sauran da'irori.Ana amfani da Cerdip tare da taga gilashi don nau'in gogewar UV EPROM da na'urorin microcomputer tare da EPROM a ciki.Tsawon tsakiyar fil shine 2.54mm kuma adadin fil daga 8 zuwa 42.
6. Kwakwalwa
Ɗaya daga cikin fakitin dutsen saman, yumbun QFP tare da hatimin ƙasa, ana amfani da shi don haɗa abubuwan da'irori na LSI kamar DSPs.Ana amfani da Cerquad tare da taga don tattara da'irori na EPROM.Rashin zafi ya fi QFPs filastik, yana ba da damar 1.5 zuwa 2W na iko a ƙarƙashin yanayin sanyi na iska.Koyaya, farashin kunshin shine sau 3 zuwa 5 sama da QFPs na filastik.Tsawon tsakiyar fil shine 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, da dai sauransu. Yawan fil ya fito daga 32 zuwa 368.
7. CLCC (ceramic gubar guntu m)
Mai ɗaukar guntu jagorar yumbu tare da fil, ɗaya daga cikin fakitin dutsen saman, ana jagorantar fil ɗin daga ɓangarorin huɗu na kunshin, a cikin siffar ding.Tare da taga don kunshin UV erasure type EPROM da microcomputer circuit with EPROM, da dai sauransu. Wannan kunshin kuma ana kiransa QFJ, QFJ-G.
8. COB (guntu a kan jirgin)
Chip akan kunshin yana ɗaya daga cikin fasahar hawan guntu mara amfani, ana ɗora guntu semiconductor akan allon da aka buga, haɗin wutar lantarki tsakanin guntu da substrate ana samun su ta hanyar ɗinkin gubar, haɗin wutar lantarki tsakanin guntu da substrate ana samun su ta hanyar hanyar ɗinkin gubar. , kuma an rufe shi da resin don tabbatar da aminci.Kodayake COB ita ce mafi sauƙin fasahar hawan guntu, amma yawan fakitinsa ya yi ƙasa da TAB da jujjuyawar fasahar siyar da guntu.
9. DFP (dual lebur kunshin)
Kunshin lebur na gefe biyu.Ita ce sunan SOP.
10. DIC (dual in-line yumbu kunshin)
Ceramic DIP (tare da hatimin gilashi) wanda ake kira.
11. DIL (dual in-line)
DIP wanda aka fi sani da DIP (duba DIP).Masu sana'ar semiconductor na Turai galibi suna amfani da wannan sunan.
12. DIP (kunshin in-line guda biyu)
Kunshin in-line sau biyu.Ɗaya daga cikin fakitin harsashi, ana jagorantar fil daga bangarorin biyu na kunshin, kayan kunshin yana da nau'i biyu na filastik da yumbu.DIP shine mafi mashahuri kunshin harsashi, aikace-aikacen sun haɗa da daidaitaccen ma'ana IC, ƙwaƙwalwar ajiya LSI, da'irorin kwamfuta na microcomputer, da sauransu.. Tsawon tsakiya na fil shine 2.54mm kuma adadin fil ya fito daga 6 zuwa 64. fakitin nisa yawanci 15.2mm.wasu fakiti masu faɗin 7.52mm da 10.16mm ana kiran su DIP na fata da slim DIP bi da bi.Bugu da kari, yumbu DIPs da aka hatimce da ƙaramin gilashin narkewa ana kuma kiran su cerdip (duba cerdip).
13. DSO (dual kananan out-lint)
Laƙabin SOP (duba SOP).Wasu masana'antun semiconductor suna amfani da wannan sunan.
14. DICP (kunshin ɗaukar hoto biyu)
Ɗaya daga cikin TCP (kunshin ɗaukar hoto).Ana yin fil ɗin akan tef ɗin da ke rufewa kuma ana fitar da su daga bangarorin biyu na kunshin.Saboda amfani da fasahar TAB (atomatik mai ɗaukar kaya) fasaha, bayanin fakitin yana da sirara sosai.Ana amfani da shi don LSI direban LCD, amma yawancin su na al'ada ne.Bugu da kari, kunshin littafin LSI mai kauri mai kauri 0.5mm yana kan haɓakawa.A cikin Japan, DICP ana kiranta DTP bisa ga ma'aunin EIAJ (Kamfanonin Wutar Lantarki da Injinan Japan).
15. DIP (dual tepe carrier kunshin)
Daidai da na sama.Sunan DTCP a cikin ma'aunin EIAJ.
16. FP (kunshin lebur)
Fakitin lebur.Laƙabin da aka yi wa QFP ko SOP (duba QFP da SOP).Wasu masana'antun semiconductor suna amfani da wannan sunan.
17. jefa-guntu
Juya guntu.Ɗaya daga cikin fasahohin marufi na guntu wanda aka yi karon ƙarfe a cikin yankin lantarki na guntu na LSI sannan kuma tulun ƙarfen ana siyar da shi zuwa wurin lantarki a kan bututun da aka buga.Yankin da kunshin ya mamaye shine ainihin girman girman guntu.Shi ne mafi ƙanƙanta kuma mafi ƙanƙanta na duk fasahar marufi.Duk da haka, idan ƙididdiga na haɓakawar thermal na substrate ya bambanta da na guntu na LSI, zai iya amsawa a haɗin gwiwa kuma ta haka yana rinjayar amincin haɗin.Sabili da haka, yana da mahimmanci don ƙarfafa guntu na LSI tare da guduro kuma a yi amfani da wani abu mai mahimmanci tare da kusan daidaitaccen haɓakar haɓakar thermal.
18. FQFP
QFP tare da ƙaramin nesa ta tsakiya, yawanci ƙasa da 0.65mm (duba QFP).Wasu masana'antun madugu suna amfani da wannan sunan.
19. CPAC(globe top pad array carrier)
Motorola's alias ga BGA.
20. CQFP (kunshin quad fiat tare da zoben gadi)
Kunshin quad fiat tare da zoben gadi.Ɗaya daga cikin QFPs na filastik, an lulluɓe fil ɗin tare da zoben guduro mai kariya don hana lankwasawa da nakasawa.Kafin hada LSI a kan bututun da aka buga, ana yanke fil daga zoben gadi kuma a yi su su zama siffar reshe na seagull (L-siffar).Wannan kunshin yana cikin samarwa da yawa a Motorola, Amurka.Tsawon tsakiyar fil shine 0.5mm, kuma matsakaicin adadin fil shine kusan 208.
21. H (tare da zafin rana)
Yana nuna alamar tare da ɗumi mai zafi.Misali, HSOP yana nuna SOP tare da nutse mai zafi.
22. fil grid array (nau'in Dutsen saman)
Nau'in Dutsen PGA yawanci kunshin nau'in harsashi ne tare da tsayin fil na kusan 3.4mm, kuma nau'in dutsen saman PGA yana da nunin fil a gefen kasan kunshin tare da tsayi daga 1.5mm zuwa 2.0mm.Tun da fil cibiyar nesa ne kawai 1.27mm, wanda shi ne rabin girman da harsashi irin PGA, da kunshin jiki za a iya sanya karami, da kuma adadin fil ne fiye da na harsashi irin (250-528), don haka shi shine kunshin da aka yi amfani da shi don manyan dabaru na LSI.Rukunin fakitin su ne nau'ikan yumbu masu yawa da kuma abubuwan bugu na resin epoxy na gilashi.Samar da fakiti tare da yumbu mai yawa substrates ya zama mai amfani.
23. JLCC (J-leaded guntu m)
Mai ɗaukar guntu mai siffar J.Yana nufin CLCC mai taga da taga ceramic QFJ wanda aka ce masa (duba CLCC da QFJ).Wasu daga cikin masana'antun na'ura mai kwakwalwa suna amfani da sunan.
24. LCC (Dauke da gubar guntu)
Mai ɗaukar guntu mara nauyi.Yana nufin fakitin dutsen saman wanda kawai na'urorin lantarki a ɓangarorin huɗu na yumbura ke cikin hulɗa ba tare da fil ba.Babban fakitin IC mai sauri da mitar mitoci, wanda kuma aka sani da yumbu QFN ko QFN-C.
25. LGA (land grid array)
Kunshin nunin lamba.Kunshin ne wanda ke da tsararrun lambobi a gefen ƙasa.Lokacin da aka haɗa, ana iya saka shi a cikin soket.Akwai lambobi 227 (nisa na tsakiya 1.27mm) da lambobi 447 (2.54mm nesa ta tsakiya) na LGAs yumbu, waɗanda ake amfani da su a cikin da'irori na LSI masu sauri.LGAs na iya ɗaukar ƙarin shigarwar shigarwa da fitilun fitarwa a cikin ƙaramin fakiti fiye da QFPs.Bugu da ƙari, saboda ƙananan juriya na jagoranci, ya dace da LSI mai sauri.Duk da haka, saboda rikitarwa da tsadar yin kwasfa, ba a amfani da su da yawa a yanzu.Ana sa ran bukatar su za ta karu nan gaba.
26. LOC (gubar kan guntu)
Fasahar fakitin LSI wani tsari ne wanda ƙarshen gaban firam ɗin gubar yana sama da guntu kuma ana yin haɗin gwiwa mai fa'ida a kusa da tsakiyar guntu, kuma haɗin wutar lantarki ana yin ta ta hanyar ɗinke jagororin tare.Idan aka kwatanta da ainihin tsarin inda aka sanya firam ɗin gubar kusa da gefen guntu, ana iya saukar da guntu a cikin girman fakiti ɗaya tare da faɗin kusan 1mm.
27. LQFP (ƙarashin fakitin quad flat)
QFP na bakin ciki yana nufin QFPs mai kauri na fakitin 1.4mm, kuma shine sunan da Associationungiyar Masana'antar Injin Lantarki ta Japan ke amfani da ita daidai da sabon ƙayyadaddun abubuwan QFP.
28. L-QUAD
Daya daga cikin yumbun QFPs.Aluminum nitride ana amfani da substrate kunshin, kuma thermal conductivity na tushe ne 7 zuwa 8 sau fiye da na aluminum oxide, samar da mafi zafi watsawa.Firam ɗin fakitin an yi shi da aluminum oxide, kuma an rufe guntu ta hanyar tukwane, don haka yana kashe farashi.Kunshin ne wanda aka haɓaka don ma'ana LSI kuma yana iya ɗaukar ikon W3 ƙarƙashin yanayin sanyaya iska.An haɓaka fakitin 208-pin (0.5mm tsakiyar farar) da 160-pin (0.65mm tsakiyar farar) don dabaru na LSI kuma an sanya su cikin samarwa da yawa a cikin Oktoba 1993.
29. MCM(multi-chip module)
Multi-chip module.Fakitin da ke tattare da kwakwalwan kwamfuta masu yawa a kan madaurin waya.Dangane da kayan da ake amfani da su, ana iya raba shi zuwa rukuni uku, MCM-L, MCM-C da MCM-D.MCM-L taro ne wanda ke amfani da madaidaicin gilashin epoxy resin multilayer da aka buga substrate.Ba shi da yawa kuma ba shi da tsada.MCM-C wani sashi ne ta amfani da fasahar fina-finai mai kauri don samar da wiring multilayer tare da yumbu (alumina ko gilashi-ceramic) azaman substrate, kama da kaurin fim ɗin ICs masu kauri ta amfani da madaidaicin yumbu mai yawa.Babu wani gagarumin bambanci tsakanin su biyun.Yawan wayoyi ya fi na MCM-L girma.
MCM-D wani bangare ne da ke amfani da fasahar fim na bakin ciki don samar da wayoyi masu yawa tare da yumbu (alumina ko aluminum nitride) ko Si da Al a matsayin masu gyara.Yawan fadada shine mafi girma a cikin nau'ikan abubuwan haɗin guda uku, amma farashin ma yana da girma.
30. MFP(mini lebur kunshin)
Ƙananan fakitin lebur.Laƙabin da ake yi wa filastik SOP ko SSOP (duba SOP da SSOP).Sunan da wasu masana'antun semiconductor ke amfani da shi.
31. MQFP(metric quad flat pack)
Rarraba QFPs bisa ga ma'aunin JEDEC (Kwamitin Na'urorin Lantarki na Haɗin gwiwa).Yana nufin daidaitaccen QFP tare da nisan tsakiyar fil na 0.65mm da kaurin jiki na 3.8mm zuwa 2.0mm (duba QFP).
32. MQUAD (metal quad)
Kunshin QFP wanda Olin, Amurka ya haɓaka.An yi farantin tushe da murfin da aka yi da aluminum kuma an rufe su da m.Yana iya ba da damar 2.5W ~ 2.8W na iko a ƙarƙashin yanayin sanyaya iska.An ba Nippon Shinko Kogyo lasisi don fara samarwa a 1993.
33. MSP(kunshin karamin murabba'i)
QFI wanda aka fi sani da QFI (duba QFI), a farkon matakin ci gaba, wanda aka fi sani da MSP, QFI shine sunan da Ƙungiyar Masana'antar Kayan Lantarki ta Japan ta tsara.
34. OPMAC(a kan molded pad array carrier)
Molded resin sealing karo mai ɗaukar hoto.Sunan da Motorola yayi amfani dashi don gyare-gyaren guduro sealing BGA (duba BGA).
35. P-(roba)
Yana nuna alamar fakitin filastik.Misali, PDIP na nufin filastik DIP.
36. PAC (pad array carrier)
Mai ɗaukar bump nuni, wanda aka laƙaba da BGA (duba BGA).
37. PCLP
Kunshin dalma maras amfani da bugu.Tsawon tsakiyar fil yana da ƙayyadaddun bayanai guda biyu: 0.55mm da 0.4mm.A halin yanzu a cikin matakin ci gaba.
38. PFPF(Plastic lebur kunshin)
Fakitin lebur filastik.Laƙabin QFP na filastik (duba QFP).Wasu masana'antun LSI suna amfani da sunan.
39. PGA
Kunshin tsararrun fil.Ɗaya daga cikin fakitin nau'in harsashi wanda a cikinsa aka shirya filaye na tsaye a gefen ƙasa a cikin tsarin nuni.M, multilayer yumbu substrates ana amfani da kunshin substrate.A cikin lokuta inda ba a bayyana sunan abu na musamman ba, yawancin PGAs ne yumbura, waɗanda ake amfani da su don babban sauri, manyan dabaru na LSI.Kudin yana da yawa.Pin cibiyoyin yawanci 2.54mm baya da fil kirga kewayo daga 64 zuwa game da 447. Don rage farashin, da kunshin substrate za a iya maye gurbinsu da wani gilashin epoxy buga substrate.Filastik PG A tare da 64 zuwa 256 fil kuma ana samunsu.Hakanan akwai nau'in nau'in dutsen fil ɗin ɗan gajeren fil (PGA-solder PGA) tare da nisan tsakiyar fil na 1.27mm.(Duba nau'in Dutsen saman PGA).
40. Kaji baya
Kunshin kunshin.Kunshin yumbu tare da soket, mai kama da siffa zuwa DIP, QFP, ko QFN.An yi amfani da shi wajen haɓaka na'urori tare da microcomputers don kimanta ayyukan tabbatar da shirin.Misali, an saka EPROM a cikin soket don gyara kuskure.Wannan fakitin ainihin samfuri ne na al'ada kuma ba a samun ko'ina a kasuwa.
Lokacin aikawa: Mayu-27-2022