A cikin tsarin samar da jeri na SMT, sau da yawa ya zama dole don amfani da SMD m, solder manna, stencil da sauran kayan taimako, waɗannan kayan taimako a cikin SMT dukan tsarin samar da taro, ingancin samfurin, ingantaccen samarwa yana taka muhimmiyar rawa.
1. Lokacin ajiya (Rayuwar Shelf)
Ƙarƙashin ƙayyadaddun sharuɗɗan, kayan ko samfur na iya har yanzu saduwa da buƙatun fasaha da kiyaye aikin da ya dace na lokacin ajiya.
2.Lokacin Wuri (Lokacin Aiki)
Manne guntu, manna mai siyar da ake amfani da shi kafin bayyanar da ƙayyadadden yanayi na iya kiyaye ƙayyadaddun sinadarai da kaddarorin jiki na mafi tsayin lokaci.
3. Dankowa (dankowa)
Chip m, solder manna a cikin halitta drip na m Properties na digo jinkiri.
4. Thixotropy (Ragowar Thixotropy)
Chip m da solder manna yana da halaye na ruwa a lokacin da extruded karkashin matsa lamba, da kuma sauri zama m roba bayan extrusion ko daina da ake ji.Wannan sifa ita ake kira thixotropy.
5. Kumburi (Slump)
Bayan bugu nastencil printersaboda nauyi da tashin hankali na sama da hawan zafin jiki ko lokacin ajiye motoci ya yi tsayi da yawa da sauran dalilai da ke haifar da raguwar tsayi, yanki na ƙasa da ke bayan ƙayyadaddun ƙayyadaddun al'amuran slump.
6. Yadawa
Nisan da mannen ya shimfiɗa a cikin zafin jiki bayan rarrabawa.
7. Adhesion (Tack)
Girman mannewa na solder manna zuwa sassa da kuma canji na ta adhesion tare da canjin lokacin ajiya bayan bugu na solder manna.
8. Jika (jikewa)
Narkakkar solder a saman jan karfe don samar da uniform, santsi kuma mara karye na siraren siraren siraren.
9. Manna Solder Mai Tsafta (Babu Tsaftace Solder Manna)
Solder manna wanda ya ƙunshi kawai burbushin ragowar solder mara lahani bayan siyarwa ba tare da tsaftace PCB ba.
10. Manna mai ƙarancin zafin jiki mai ƙarancin zafi
Solder manna tare da narkewa zafin jiki ƙasa da 163 ℃.
Lokacin aikawa: Maris 16-2022