Wasu na kowa matsaloli da kuma mafita a soldering

Kumfa a kan PCB substrate bayan SMA soldering

Babban dalilin bayyanar girman ƙusa bayan waldawar SMA kuma shine danshin da ke cikin PCB substrate, musamman a cikin sarrafa allunan multilayer.Domin multilayer jirgin da aka yi da Multi-Layer epoxy guduro prepreg, sa'an nan zafi guga man, idan ajiya lokaci na epoxy guduro Semi curing yanki ne ma takaice, da guduro abun ciki bai isa ba, da danshi kau da pre bushewa ba mai tsabta. yana da sauƙi don ɗaukar tururin ruwa bayan danna zafi.Har ila yau, saboda Semi-m kanta manne abun ciki bai isa ba, mannewa tsakanin yadudduka bai isa ba kuma ya bar kumfa.Bugu da ƙari, bayan an sayi PCB, saboda dogon lokacin ajiya da kuma yanayin ajiya mai ɗanɗano, ba a yin gasa guntu a cikin lokaci kafin samarwa, kuma PCB mai ɗanɗano shima yana da saurin kumburi.

Magani: Ana iya saka PCB cikin ajiya bayan karɓa;PCB yakamata a fara gasa a (120 ± 5) ℃ na awanni 4 kafin sanyawa.

Bude kewayawa ko siyar da arya na IC fil bayan soldering

Dalilai:

1) Rashin haɗin kai, musamman ga na'urorin fqfp, yana haifar da nakasar fil saboda rashin ajiya mara kyau.Idan mai hawan ba shi da aikin duba coplanarity, ba shi da sauƙi a gano.

2) Poor solderability na fil, dogon ajiya lokaci na IC, yellowing fil da matalauta solderability su ne manyan dalilai na ƙarya soldering.

3) Solder manna yana da mara kyau ingancin, low karfe abun ciki da matalauta solderability.The solder manna yawanci amfani da waldi fqfp na'urorin ya kamata su sami karfe abun ciki na ba kasa da 90%.

4) Idan preheating zafin jiki ne ma high, yana da sauki don sa hadawan abu da iskar shaka na IC fil da kuma sa solderability muni.

5) Girman taga samfuri na bugu ƙanana ne, don haka adadin manna mai siyarwa bai isa ba.

sharuddan sasantawa:

6) Kula da ajiyar na'urar, kar a dauki bangaren ko bude kunshin.

7) A lokacin samarwa, ya kamata a bincika solderability na abubuwan da aka gyara, musamman lokacin ajiyar IC bai kamata ya yi tsayi da yawa ba (a cikin shekara guda daga ranar da aka yi), kuma IC bai kamata a fallasa yanayin zafi da zafi yayin ajiya ba.

8) A hankali duba girman taga samfuri, wanda bai kamata ya zama babba ko ƙarami ba, kuma a kula da dacewa da girman kushin PCB.