Binciken SPI tsarin dubawa ne na fasahar sarrafa SMD, wanda galibi ke gano ingancin bugu na manna.
Cikakken sunan SPI na Ingilishi shine Solder Paste Inspection, ka'idodinsa yayi kama da AOI, suna ta hanyar siyan gani sannan kuma suna samar da hotuna don tantance ingancinsa.
Ka'idar aiki na SPI
A cikin samar da taro na pcba, injiniyoyi za su buga wasu allunan pcb kaɗan, SPI a cikin kyamarar aikin za su ɗauki hotuna na PCB (tarin bayanan bugu), bayan algorithm yayi nazarin hoton da aikin ke samarwa, sa'an nan da hannu ya tabbatar da ko yana da kyau. ba lafiya.idan yayi kyau, zai zama bayanan bugu na hukumar a matsayin ma'auni don samar da taro na gaba zai dogara ne akan bayanan bugu don yin hukunci!
Me yasa SPI dubawa
A cikin masana'antar, fiye da kashi 60% na lahani na siyarwar suna faruwa ne ta hanyar rashin kyawun bugu na solder, don haka ƙara cak bayan buguwar solder fiye da bayan matsalolin saida sannan a koma ƙungiyar don adana kuɗi.Saboda binciken SPI bai yi kyau ba, zaku iya kai tsaye daga tashar docking don saukar da pcb mara kyau, wanke kayan da aka saka akan pads za'a iya sake buga su, idan an gyara bayan na'urar sannan kuma samu, to kuna buƙatar amfani da ƙarfe. gyara ko ma datti.Dangantakar magana, zaku iya adana farashi
Wadanne abubuwa mara kyau ne SPI ke ganowa
1. Solder manna bugu diyya
Solder manna bugu diyya zai sa a tsaye abin tunawa ko komai waldi, saboda solder manna biya diyya daya karshen kushin, a cikin soldering zafi narke, da biyu iyakar solder manna zafi narke zai bayyana lokaci bambanci, shafi tashin hankali, daya karshen. ana iya karkata.
2. Solder manna bugu flatness
Solder manna bugu flatness yana nuna cewa pcb pad surface solder manna ba lebur ba ne, ƙarin tin a gefe ɗaya, ƙarancin tin a ƙarshen ɗaya, zai haifar da ɗan gajeren kewayawa ko haɗarin tsayawar abin tunawa.
3. Kauri na solder manna bugu
Solder manna bugu kauri ne ma kadan ko da yawa solder manna yayyo bugu, zai haifar da hadarin soldering fanko solder.
4. Solder manna bugu ko ja tip
Solder manna bugu ja tip da solder manna flatness iri ɗaya ne, saboda solder manna bayan bugu don saki mold, idan da sauri da kuma jinkirin iya bayyana ja tip.
Ƙididdiga na Injin NeoDen S1 SPI
Tsarin canja wurin PCB: 900± 30mm
Min PCB Girman: 50mm × 50mm
Matsakaicin girman PCB: 500mm × 460mm
PCB kauri: 0.6mm ~ 6mm
Fitar gefen faranti: sama: 3mm ƙasa: 3mm
Saurin canja wuri: 1500mm/s (MAX)
Lankwasawa faranti: <2mm
Kayan aikin direba: Tsarin motar AC servo
Saitin daidaito: <1 μm
Gudun motsi: 600mm/s
Lokacin aikawa: Yuli-20-2023