I. Bayanin bango
Na'ura mai siyar da igiyar ruwawaldi ne ta hanyar narkakkar solder a kan bangaren fil ga aikace-aikace na solder da dumama, saboda da dangi motsi na kalaman da kuma PCB da narkakkar solder "m", kalaman soldering tsari ne mafi hadaddun fiye da reflow soldering, da za a soldered kunshin. fil tazara, fil fitar da tsawo, kushin size ake bukata, a kan PCB The layout na hukumar shugabanci, tazara, kazalika da shigarwa na rami line kuma yana da bukatun, a takaice, da kalaman soldering tsari ne matalauta, m, walda. yawan amfanin ƙasa ya dogara da ƙira.
II.Bukatun marufi
1. dace da kalaman soldering jeri kashi kamata da solder karshen ko gubar fallasa;Jikin fakitin daga izinin ƙasa (Tsaya Kashe) <0.15mm;Tsawo <4mm ainihin buƙatun.Cika waɗannan sharuɗɗan abubuwan da aka haɗa sun haɗa da:
0603 ~ 1206 girman girman fakitin abubuwan haɗin guntu masu tsayayya.
SOP tare da nisan cibiyar gubar ≥1.0mm da tsayi <4mm.
Chip inductors tare da tsayi ≤ 4mm.
Inductor guntu ba fallasa (watau C, nau'in M)
2. dace da igiyar ruwa soldering na m ƙafa harsashi aka gyara ga m nisa tsakanin m fil ≥ 1.75mm kunshin.
III.Hanyar watsawa
Kafin kalaman soldering surface bangaren layout, na farko ya kamata kayyade PCB a kan tanderun watsa shugabanci, shi ne layout na harsashi aka gyara "tsari benchmark".Saboda haka, kafin kalaman soldering surface aka gyara layout, na farko ya kamata ƙayyade shugabanci na watsawa.
1. Gaba ɗaya, gefen tsayi ya kamata ya zama jagorar watsawa.
2. Idan shimfidar wuri tana da mai haɗin harsashi na ƙafa (fiti <2.54mm), jagorar shimfidar mahaɗin ya kamata ya zama alkiblar watsawa.
3. a cikin igiyar ruwa soldering surface, ya kamata a siliki-launi ko jan karfe etched kibiya alama shugabanci watsa, domin gane lokacin waldi.
IV.Hanyar shimfidawa
Jagoran shimfidar wuri na abubuwan ya ƙunshi abubuwan haɗin guntu da masu haɗawa da yawa.
1. dogon shugabanci na SOP na'urar kunshin ya kamata a layi daya da kalaman soldering watsa shugabanci layout, da dogon shugabanci na guntu aka gyara, ya zama perpendicular ga kalaman soldering watsa shugabanci.
2. mahara biyu-pin harsashi aka gyara, jack cibiyar line shugabanci ya zama perpendicular ga shugabanci na watsawa, domin rage sabon abu na daya karshen bangaren iyo iyo.
V. Bukatun tazara
Don abubuwan SMD, tazarar kushin yana nufin tazara tsakanin matsakaicin halayen isarwa na fakitin kusa (ciki har da pads);don abubuwan harsashi, tazarar kushin yana nufin tazara tsakanin pads na solder.
Don abubuwan haɗin SMD, tazarar kushin baya gaba ɗaya daga bangarorin haɗin gada, gami da toshewar jikin fakitin na iya haifar da zubar solder.
1. harsashi aka gyara kushin tazara ya kamata kullum zama ≥ 1.00mm.don masu haɗin harsashi masu kyau, ba da izinin raguwa da ya dace, amma mafi ƙarancin kada ya zama <0.60mm.
2. Mashinan kayan kwalliyar harsashi da mashinan siyar da igiyoyin SMD ya kamata su kasance ≥ 1.25mm tazara.
VI.Pad zane na musamman bukatun
1. don rage leakage soldering, don 0805/0603, SOT, SOP, tantalum capacitor pads, an bada shawarar cewa zane daidai da wadannan bukatun.
Don abubuwan 0805/0603, daidai da IPC-7351 da aka ba da shawarar ƙira (kushin flare 0.2mm, nisa an rage ta 30%).
Don SOT da tantalum capacitors, ya kamata a faɗaɗa pads waje da 0.3mm idan aka kwatanta da na'urorin da aka tsara akai-akai.
2. don metalized rami farantin karfe, ƙarfin solder hadin gwiwa yafi dogara a kan rami dangane, kushin zobe nisa ≥ 0.25mm iya zama.
3. Don farantin ramin da ba tare da ƙarfe ba (kwangi guda ɗaya), ƙarfin haɗin haɗin gwiwa yana ƙaddara ta girman kushin, babban diamita na kushin ya kamata ya zama ≥ 2.5 sau diamita na rami.
4. don kunshin SOP, yakamata a tsara shi a ƙarshen fil ɗin tinned satar tin pads, idan filin SOP yana da girma sosai, satar kushin tin ɗin kuma na iya zama babba.
5. don masu haɗa nau'i-nau'i masu yawa, ya kamata a tsara su a cikin ƙarshen tin ɗin da aka sace.
VII.Fitar da tsayi
1. Gubar fitar da tsawon samuwar gada yana da dangantaka mai kyau, ƙarami tazarar fil, mafi girman tasirin shawarwarin gabaɗaya:
Idan fil ɗin fil yana tsakanin 2 ~ 2.54mm, ya kamata a sarrafa tsawon tsayin jagorar a 0.8 ~ 1.3mm
Idan fil ɗin fil <2mm, yakamata a sarrafa tsawon tsayin jagorar a 0.5 ~ 1.0mm
2. jagorar fitar da tsayi kawai a cikin jagorar shimfidar wuri don saduwa da buƙatun yanayin siyar da igiyar ruwa na iya taka rawa, in ba haka ba kawar da tasirin haɗin gada ba a bayyane yake ba.
VIII.aikace-aikace na solder tsayayya tawada
1. Sau da yawa muna ganin wasu matsayi na haɗe-haɗe da aka buga tare da zane-zane na tawada, irin wannan ƙira ana la'akari da shi don rage abubuwan da ke faruwa na bridging.The inji na iya zama tawada surface surface ne in mun gwada da m, sauki adsorb more juyi, juyi hadu da high zafin jiki narkakkar solder volatilization da samuwar kadaici kumfa, game da shi rage abin da ya faru na bridging.
2. Idan nisa tsakanin fil pads <1.0mm, za ka iya tsara solder tsayayya tawada Layer a waje da gammaye don rage yuwuwar gada, wanda yafi kawar da m gammaye tsakanin tsakiyar solder hadin gwiwa bridging, da kuma satar tin. pads galibi suna kawar da rukunin kushin mai yawa na ƙarshe na lalatawar haɗin gwiwar solder wanda ke haɗa ayyukansu daban-daban.Don haka, don tazarar fil ɗin tana da ɗan ƙaramin faffadan ɗimbin yawa, ya kamata a yi amfani da tawada mai satar da sata tare.
Lokacin aikawa: Dec-14-2021