Menene Fa'idodi da Rashin Amfanin Kunshin BGA?

I. BGA kunshin shine tsarin marufi tare da mafi girman buƙatun walda a masana'antar PCB.Amfaninsa sune kamar haka:
1. Short fil, low taro tsawo, kananan parasitic inductance da capacitance, m lantarki yi.
2. Haɗin kai sosai, fil masu yawa, babban tazarar fil, mai kyau fil coplanar.Iyakar tazarar fil na lantarkin QFP shine 0.3mm.Lokacin haɗa allon da'irar walda, daidaiton hawan guntu na QFP yana da tsauri sosai.Amincewar haɗin wutar lantarki yana buƙatar haƙurin hawa ya zama 0.08mm.Filayen lantarki na QFP tare da kunkuntar tazara suna da sirara kuma masu rauni, masu sauƙin murɗawa ko karyewa, waɗanda ke buƙatar daidaito da tsari tsakanin fil ɗin allon kewayawa dole ne a sami garanti.Sabanin haka, babban fa'idar kunshin BGA shine cewa tazarar fil ɗin 10-electrode babba ce, tazara ta al'ada ita ce 1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), haƙurin hawa shine 0.3mm, tare da talakawan Multi Multi. -aikiInjin SMTkumareflow tandaiya m cika bukatun BGA taro.

II.Duk da yake BGA encapsulation yana da fa'idodi na sama, yana kuma da matsaloli masu zuwa.Waɗannan su ne rashin amfani na BGA encapsulation:
1. Yana da wuya a bincika da kuma kula da BGA bayan walda.Dole ne masana'antun PCB su yi amfani da gwajin fluoroscopy na X-ray ko duban shimfidar radiyo na X-ray don tabbatar da amincin haɗin walda na allon da'ira, kuma farashin kayan aiki ya yi yawa.
2. An karye kayan haɗin gwal guda ɗaya na allon kewayawa, don haka dole ne a cire dukkan ɓangaren, kuma ba za a iya sake amfani da BGA da aka cire ba.