Menene Hanyoyin Haɓaka Siyar da Hukumar PCBA?

A cikin aiwatar da sarrafa PCBA, akwai matakai da yawa na samarwa, waɗanda ke da sauƙin samar da matsaloli masu inganci da yawa.A wannan lokacin, yana da mahimmanci don haɓaka hanyar waldawar PCBA koyaushe da haɓaka tsari don haɓaka ingancin samfur yadda yakamata.

I. Inganta zafin jiki da lokacin walda

Alamar intermetallic tsakanin jan karfe da tin suna samar da hatsi, siffar da girman hatsi ya dogara da tsawon lokaci da ƙarfin zafin jiki lokacin sayar da kayan aiki irin su.reflow tandakokalaman soldering inji.PCBA SMD aiki dauki lokaci ya yi tsayi da yawa, ko saboda dogon waldi lokaci ko saboda high zafin jiki ko duka biyu, zai kai ga m crystal tsarin, da tsarin ne gravelly da gaggautsa, da karfi ƙarfi ne kananan.

II.Rage tashin hankali

Haɗin kai da gubar tin ya ma fi ruwa girma, ta yadda mai siyar ya zama wani yanki don rage girman girmansa (ƙara ɗaya, sararin sama yana da ƙaramin yanki idan aka kwatanta da sauran siffofi na geometric, don biyan bukatun mafi ƙarancin yanayin makamashi. ).Matsayin juzu'i yana kama da rawar da masu tsaftacewa suke yi akan farantin karfe da aka lullube da man shafawa, Bugu da ƙari, tashin hankali na saman yana dogara sosai akan matakin tsabta da zafin jiki, kawai lokacin da makamashin adhesion ya fi girma fiye da farfajiya. makamashi (haɗin kai), kyakkyawan tin tsoma zai iya faruwa.

III.PCBA allon tsoma tin kwana

Kimanin 35 ℃ mafi girma fiye da zafin jiki na eutectic na solder, lokacin da digo na solder da aka sanya a saman zafi mai rufi tare da ruwa, an samar da saman wata mai lanƙwasa, ta wata hanya, za a iya kimanta ikon da karfen don tsoma tin. ta siffar fuskar wata mai lankwasawa.Idan solder lankwasawa watã surface yana da bayyananne kasa yanke baki, siffa kamar wani greased karfe farantin a kan ruwa droplets, ko ma ayan mai siffar zobe, karfe ba solderable.Sai kawai mai lankwasa saman wata ya shimfiɗa a cikin ƙaramin kusurwa na ƙasa da 30. Sai kawai mai kyau weldability.

IV.Matsalar porosity da ake samu ta hanyar walda

1. Baking, PCB da abubuwan da aka fallasa zuwa iska na dogon lokaci don yin gasa, don hana danshi.

2. Solder manna sarrafa, solder manna dauke da danshi shi ma yana yiwuwa ga porosity, kwano beads.Da farko, yi amfani da mai kyau ingancin solder manna, solder manna tempering, stirring bisa ga aiki na tsananin aiwatar, solder manna fallasa zuwa ga iska ga gajeren lokaci kamar yadda zai yiwu, bayan bugu solder manna, da bukatar dace reflow soldering.

3. Kula da zafi na bita, wanda aka tsara don saka idanu da zafi na bitar, sarrafawa tsakanin 40-60%.

4. Saita ma'aunin zafin jiki mai ma'ana, sau biyu a rana a kan gwajin zafin wutar lantarki, inganta yanayin zafin wutar lantarki, yawan zafin jiki ba zai iya zama da sauri ba.

5. Flux spraying, a overSMD kalaman sayar da na'ura, Adadin juye juye ba zai iya zama da yawa ba, fesa m.

6. Haɓaka ma'aunin zafin jiki na tanderun, zafin jiki na yankin preheating yana buƙatar saduwa da buƙatun, ba ƙananan ƙananan ba, don haka juyi zai iya cikawa sosai, kuma saurin tanderun ba zai iya zama da sauri ba.