SMT yana daya daga cikin muhimman abubuwan da aka gyara na lantarki, wanda ake kira dabarun hada-hadar waje, wanda aka kasu zuwa babu fil ko gajeriyar gubar, ta hanyar aiwatar da reflow soldering ko tsoma soldering zuwa walda taron dabaru na da'ira, shi ma yanzu ya fi shahara a cikin lantarki taro masana'antu a dabara.Ta hanyar aiwatar da fasahar SMT don hawa ƙarin ƙarami da ƙananan sassa, don haka allon kewayawa don kammala babban kewaye, buƙatun miniaturization, wanda kuma akan buƙatar ƙwarewar sarrafa SMT mafi girma.
I. SMT sarrafa solder manna wajibi ne don kula
1. Constant zafin jiki: yunƙuri a cikin firiji ajiya zazzabi na 5 ℃ -10 ℃, don Allah kada ku je kasa 0 ℃.
2. Daga cikin ajiya: dole ne a bi ka'idodin ƙarni na farko na farko fita, kar a samar da solder manna a cikin injin daskarewa lokacin ajiya ya yi tsayi da yawa.
3. Daskarewa: Daskare abin da ake sayar da shi ta dabi'a na akalla sa'o'i 4 bayan cire shi daga cikin injin daskarewa, kar a rufe hular lokacin daskarewa.
4. Halin: The bitar zafin jiki ne 25 ± 2 ℃ da dangi zafi ne 45% -65% RH.
5. Manna tsohon solder da aka yi amfani da shi: Bayan buɗe murfin shirin manna mai siyar a cikin awanni 12 don amfani, idan kuna buƙatar riƙewa, da fatan za a yi amfani da kwalabe mai tsabta don cika, sannan a rufe a cikin injin daskarewa don riƙewa.
6. a kan adadin manna a kan stencil: a karo na farko a kan adadin solder manna a kan stencil, domin buga da juyawa kada ka haye scraper tsawo na 1/2 a matsayin mai kyau, yi m dubawa, m Bugu da kari na sau don ƙara ƙasa da adadin.
II.SMT guntu sarrafa bugu aiki wajibi ne don kula
1. scraper: scraper abu ne mafi kyau ga dauko karfe scraper, conducive zuwa bugu a kan PAD solder manna gyare-gyare da kuma tsiri fim.
Scraper kusurwa: bugu na hannu don digiri 45-60;inji bugu na 60 digiri.
Saurin bugawa: manual 30-45mm/min;inji 40mm-80mm/min.
Yanayin bugawa: zazzabi a 23± 3 ℃, dangi zafi 45% -65% RH.
2. Stencil: Buɗewar stencil ya dogara ne akan kauri na stencil da siffar da rabon buɗewa bisa ga buƙatar samfurin.
3. QFP / CHIP: tsaka-tsakin tsakiya bai wuce 0.5mm ba kuma 0402 CHIP yana buƙatar buɗewa tare da laser.
Gwajin stencil: don dakatar da gwajin tashin hankali sau ɗaya a mako, ana buƙatar ƙimar tashin hankali ya kasance sama da 35N/cm.
Share stencil: Lokacin buga 5-10 PCBs ci gaba, shafa stencil sau ɗaya tare da takarda goge mara ƙura.Kada a yi amfani da tsummoki.
4. Wakilin tsaftacewa: IPA
Magani: Hanya mafi kyau don tsaftace stencil shine yin amfani da IPA da barasa masu kaushi, kada ku yi amfani da abubuwan da ke dauke da chlorine, saboda zai lalata abun da ke cikin manna mai siyar kuma yana shafar ingancin.
Lokacin aikawa: Jul-05-2023