Mabuɗin wannan labarin
- Fakitin BGA suna da ƙarfi a girman kuma suna da girman fil.
- A cikin fakitin BGA, siginar sigina saboda daidaitawar ball da rashin daidaituwa ana kiranta BGA crosstalk.
- BGA crosstalk ya dogara da wurin siginar mai kutse da siginar wanda aka azabtar a cikin jerin gwanon ƙwallon ƙwallon.
A cikin Multi-gate da fil-count ICs, matakin haɗin kai yana ƙaruwa sosai.Waɗannan kwakwalwan kwamfuta sun zama mafi aminci, ƙarfi, da sauƙin amfani godiya ga haɓakar fakitin grid array (BGA), waɗanda suka fi ƙanƙanta da girma da kauri kuma sun fi girma a adadin fil.Koyaya, BGA crosstalk yana tasiri sosai ga amincin sigina, don haka yana iyakance amfani da fakitin BGA.Bari mu tattauna marufi BGA da BGA crosstalk.
Fakitin Grid Array
Kunshin BGA wani fakitin dutsen saman ƙasa ne wanda ke amfani da ƙananan ƙwallan madugun ƙarfe don hawa da'irar da aka haɗa.Waɗannan ƙwallayen ƙarfe suna samar da tsarin grid ko matrix wanda aka shirya ƙarƙashin saman guntu kuma an haɗa su da allon da'ira da aka buga.
Kunshin grid array (BGA).
Na'urorin da aka tattara a cikin BGAs ba su da fil ko jagora akan gefen guntu.Madadin haka, ana sanya jeri na grid ball a ƙasan guntu.Wadannan grid grid ana kiran su ƙwallan solder kuma suna aiki azaman masu haɗawa don kunshin BGA.
Microprocessors, kwakwalwan kwamfuta na WiFi, da FPGAs galibi suna amfani da fakitin BGA.A cikin guntu kunshin BGA, ƙwallayen solder suna ƙyale halin yanzu gudana tsakanin PCB da fakitin.Waɗannan ƙwallayen siyar ana haɗe su ta zahiri da na'ura mai ɗaukar hoto na lantarki.Ana amfani da haɗakar da gubar ko guntu-guntu don kafa haɗin wutar lantarki zuwa ƙasa kuma ya mutu.Adaidaita sahu suna samuwa a cikin madaidaicin abin da ke ba da damar watsa siginar lantarki daga mahaɗin tsakanin guntu da ma'auni zuwa mahaɗar tsakanin ma'auni da grid grid.
Kunshin BGA yana rarraba hanyoyin haɗin kai a ƙarƙashin mutu a cikin tsarin matrix.Wannan tsari yana ba da mafi girman adadin jagora a cikin kunshin BGA fiye da fakitin lebur da jeri biyu.A cikin kunshin jagora, ana shirya fil a kan iyakoki.kowane fil na kunshin BGA yana ɗauke da ƙwallon solder, wanda ke kan ƙasan saman guntu.Wannan tsari a ƙasan ƙasa yana ba da ƙarin yanki, yana haifar da ƙarin fil, ƙarancin toshewa, da ƙarancin guntun gubar.A cikin kunshin BGA, ƙwallayen siyar suna daidaitawa nesa ba kusa ba fiye da cikin kunshin da ke da jagora.
Amfanin fakitin BGA
Kunshin BGA yana da ƙaƙƙarfan girma da babban finin fil.kunshin BGA yana da ƙananan inductance, yana ba da damar amfani da ƙananan ƙarfin lantarki.Tsarin grid ɗin ƙwallon yana da nisa sosai, yana sauƙaƙa daidaita guntuwar BGA tare da PCB.
Wasu fa'idodin fakitin BGA sune:
- Kyakkyawan zafi mai zafi saboda ƙananan juriya na thermal na kunshin.
- Tsawon gubar a cikin fakitin BGA ya fi guntu fiye da fakitin da ke da jagora.Adadin jagororin da aka haɗa tare da ƙaramin ƙarami yana sa kunshin BGA ya fi ƙarfin aiki, don haka haɓaka aiki.
- Fakitin BGA suna ba da babban aiki a cikin babban sauri idan aka kwatanta da fakitin lebur da fakitin layi biyu.
- Gudu da yawan amfanin PCB yana ƙaruwa lokacin amfani da na'urori masu kunshe da BGA.Tsarin siyarwar ya zama mai sauƙi kuma mafi dacewa, kuma ana iya sake yin aikin fakitin BGA cikin sauƙi.
BGA Crosstalk
Fakitin BGA suna da wasu kura-kurai: ƙwallayen siyarwa ba za a iya lankwasa su ba, dubawa yana da wahala saboda yawan fakitin, kuma haɓakar girma yana buƙatar amfani da kayan siyar da tsada.
Don rage BGA crosstalk, tsarin BGA mai ƙaranci yana da mahimmanci.
Ana yawan amfani da fakitin BGA a cikin adadi mai yawa na na'urorin I/O.Sigina da aka watsa da karɓa ta haɗaɗɗen guntu a cikin fakitin BGA na iya damuwa ta hanyar haɗa wutar lantarki ta sigina daga wannan jagora zuwa wani.Maganar siginar siginar da aka haifar ta hanyar daidaitawa da daidaitawar ƙwallan saida a cikin kunshin BGA ana kiranta crosstalk BGA.Ƙayyadaddun inductance tsakanin grid grid arrays yana ɗaya daga cikin abubuwan da ke haifar da tasiri a cikin fakitin BGA.Lokacin da manyan masu wucewa na I/O na yanzu (siginar kutsawa) ke faruwa a cikin fakitin BGA, ƙarancin inductance tsakanin grid grid ɗin da ya dace da sigina da kuma dawo da fil yana haifar da tsangwama a kan guntu substrate.Wannan tsangwama na wutar lantarki yana haifar da ƙulli na sigina da ake watsawa daga cikin kunshin BGA a matsayin hayaniya, yana haifar da tasirin crosstalk.
A aikace-aikace kamar tsarin sadarwar tare da PCB masu kauri waɗanda ke amfani da ramuka, BGA crosstalk na iya zama gama gari idan ba a ɗauki matakan kare ramukan ba.A cikin irin waɗannan da'irori, tsayin ramukan da aka sanya a ƙarƙashin BGA na iya haifar da haɗakarwa mai mahimmanci kuma ya haifar da tsangwama mai ganuwa.
BGA crosstalk ya dogara da wurin siginar mai kutsawa da siginar wanda aka azabtar a cikin jerin gwanon ƙwallon ƙwallon.Don rage tafsirin BGA, tsarar fakitin BGA maras nauyi yana da mahimmanci.Tare da software na Cadence Allegro Package Designer Plus, masu zanen kaya na iya haɓaka hadaddun mutun-mutu-mutu-daya-mutu-mutu-mutu da yawa da ƙirar guntu-guntu;radial, cikakken kusurwar tura-matsi don magance ƙalubalen ƙalubale na ƙirar ƙirar BGA/LGA.da takamaiman DRC/DFA cak don ƙarin ingantacciyar hanya da inganci.Takamaiman DRC/DFM/DFA cak suna tabbatar da ƙirar BGA/LGA masu nasara a cikin fasfo ɗaya.Hakanan an bayar da cikakken hakar haɗin haɗin kai, ƙirar fakitin 3D, da amincin sigina da bincike na zafi tare da abubuwan samar da wutar lantarki.
Lokacin aikawa: Maris 28-2023