sarrafa SMD shine makawa tsarin gwaji, SPI (Solder Manna Inspection) shine tsarin sarrafa SMD tsarin gwaji ne, ana amfani dashi don gano ingancin bugu mai kyau ko mara kyau.Me yasa kuke buƙatar kayan aikin spi bayan buguwar manna solder?Domin bayanai daga masana'antu game da 60% na ingancin sayar da shi ne saboda matalauta solder manna bugu (saura iya zama alaka da faci, reflow tsari).
SPI shine gano mummunan bugu na solder,Injin SMT SPIyana cikin bayan na'urar bugu na man fetir, lokacin da mai siyar ta manna bayan buga wani yanki na pcb, ta hanyar haɗin tebur na jigilar kaya zuwa kayan gwajin SPI don gano ingancin bugunsa.
SPI na iya gano waɗanne miyagun batutuwa?
1. Ko mai sayar da manna ko da tin ne
SPI na iya gano ko na'urar buga bugu mai siyar, idan pcb madaidaicin pads ko da tin, zai iya kaiwa ga gajeriyar kewayawa.
2. Manna diyya
Solder manna diyya yana nufin cewa solder manna bugu ba a buga a kan pcb gammaye (ko kawai wani ɓangare na solder manna buga a kan gammaye), solder manna bugu diyya zai iya kai ga m soldering ko a tsaye abin tunawa da sauran matalauta ingancin.
3. Gano kauri na manna solder
SPI tana gano kaurin faifan solder, wani lokaci adadin man yakan yi yawa, wani lokacin adadin man ya ragu, wannan yanayin zai haifar da waldawar walda ko babu komai.
4. Gano flatness na solder manna
SPI tana gano lebur na man na'urar solder, saboda za'a rushe na'urar da za a buga bayan bugu, wasu za su bayyana sun ja tip, lokacin da flatness ba lokaci ɗaya ba ne, yana da sauƙi don haifar da matsalolin ingancin walda.
Ta yaya SPI ke gano ingancin bugu?
SPI na ɗaya daga cikin na'urorin gano na gani, amma kuma ta hanyar tsarin gani da kwamfuta algorithms don kammala ka'idar ganowa, solder manna bugu, spi ta cikin ruwan tabarau na kyamarar da ke saman kyamarar don cire bayanai, sannan algorithms fitarwa ya haɗa. hoton ganowa, sannan tare da bayanan samfurin ok don kwatancen, idan aka kwatanta da ok har zuwa ma'auni za a ƙaddara azaman allo mai kyau, idan aka kwatanta da ok ba a ba da ƙararrawa ba, masu fasaha na iya zama masu fasaha na iya cire lahani kai tsaye. alluna daga bel mai ɗaukar nauyi
Me yasa binciken SPI ke ƙara zama sananne?
Kamar da aka ambata cewa yuwuwar walda bad saboda solder manna bugu lalacewa ta hanyar fiye da 60%, idan ba bayan spi gwajin domin sanin mara kyau, zai zama kai tsaye a baya faci, reflow soldering tsari, a lõkacin da kammala waldi sa'an nan bayan aoi. gwajin da aka samu mara kyau, a gefe guda, kulawar matakin matsala zai zama mafi muni fiye da spi don ƙayyade lokacin mummunan matsala (Hukuncin SPI na bugu mara kyau, kai tsaye daga bel mai ɗaukar kaya don ɗauka, wanke kashe manna) , a daya bangaren, bayan walda, za a iya sake amfani da mummunan allo, da kuma bayan waldi, da fasaha iya kai tsaye saukar da mugun allo daga na'ura bel.Ana iya sake amfani da shi), baya ga gyaran walda zai haifar da ƙarin ɓarna na ma'aikata, kayan aiki da albarkatun kuɗi.
Lokacin aikawa: Oktoba-12-2023