SMT reflow tandatare da nitrogen (N2) shine muhimmiyar rawa wajen rage oxidation surface na walda, inganta wettability na walda, saboda nitrogen wani nau'i ne na iskar gas, ba sauki don samar da mahadi da karfe ba, kuma yana iya yanke iskar oxygen a cikin iska. da karfe lamba a high zafin jiki da kuma hanzarta hadawan abu da iskar shaka dauki.
Da fari dai, ka'idar cewa nitrogen iya inganta SMT weldability dogara ne a kan gaskiyar cewa surface tashin hankali na solder karkashin nitrogen yanayi ne kasa da cewa fallasa zuwa yanayi yanayi, wanda inganta fluidity da wettability na solder.
Abu na biyu, nitrogen rage solubility na oxygen a cikin asali iska da kuma abu da zai iya gurɓata walda surface, ƙwarai rage hadawan abu da iskar shaka na high zafin jiki solder, musamman a inganta na biyu gefen backwelding quality.
Nitrogen ba panacea ga PCB hadawan abu da iskar shaka.Idan saman wani abu ko allon da'ira ya cika da yawa, nitrogen ba zai dawo da shi zuwa rai ba, kuma nitrogen yana da amfani kawai ga ƙaramin iskar oxygen.
Amfaninsolder reflow tandatare da nitrogen:
Rage iskar iska ta wuta
Inganta ƙarfin walda
Haɓaka solderability
Rage ƙimar rami.Saboda solder manna ko solder kushin hadawan abu da iskar shaka an rage, kwarara na solder ne mafi alhẽri.
LalacewarSMT soldering injitare da nitrogen:
ƙone
Yana ƙara samun damar ƙarni na dutsen kabari
Ingantattun capillarity (tasirin wick)
Lokacin aikawa: Agusta-24-2021