Nazari kan Dalilan Ci gaba da Sayar da Taimako tare da Sayar da igiyar ruwa

1. rashin dacewa preheating zafin jiki.Matsakaicin zafin jiki zai haifar da ƙarancin kunna juyi ko allon PCB da rashin isasshen zafin jiki, wanda zai haifar da ƙarancin zafin jiki, ta yadda ruwa mai siyar da ruwa ya zama mara kyau, layin da ke kusa tsakanin gada ta haɗin gwiwa.

2. Flux preheat zafin jiki yana da girma ko kuma ƙasa, gabaɗaya a cikin 100 ~ 110 digiri, preheat yayi ƙasa da ƙasa, aikin juzu'i ba shi da girma.Yi zafi sosai, cikin gwangwanin karfen gwangwani ya tafi, amma kuma yana da sauƙi ga ko da tin.

3. Babu juzu'i ko juzu'i bai isa ba ko rashin daidaituwa, ba a sakin yanayin yanayin narkakkar na tin, yana haifar da sauƙi har ma da tin.

4. Bincika zafin wutar lantarki, sarrafa shi a kusa da digiri 265, yana da kyau a yi amfani da ma'aunin zafi da sanyio don auna zafin raƙuman ruwa lokacin da aka kunna igiyar ruwa, saboda yanayin zafi na kayan aiki na iya kasancewa a ƙasa. na murhu ko sauran wurare.Rashin isasshen zafin jiki na preheating zai haifar da abubuwan da ba za a iya kaiwa ga zafin jiki ba, tsarin walda saboda haɓakar zafin jiki, wanda ke haifar da ƙarancin ja tin, da samuwar ko da tin;za a iya samun ƙarancin zafin wuta na murhu, ko saurin walda yana da sauri.

5. Hanyar aiki mara kyau lokacin tsoma tin.

6. dubawa na yau da kullum don yin nazarin abun da ke ciki na tin, za'a iya samun jan karfe ko wani abun ciki na karfe ya wuce misali, wanda ya haifar da motsi na tin yana raguwa, mai sauƙi don haifar da ko da tin.

7. najasa solder, solder a cikin haɗe ƙazanta ya zarce ma'auni da aka yarda, halaye na solder zai canza, wetting ko fluidity zai zama sannu a hankali ya zama mafi muni, idan antimony abun ciki na fiye da 1.0%, arsenic fiye da 0.2%, ware fiye da 0.15%, za a rage yawan ruwa na solder da 25%, yayin da abun ciki na arsenic na kasa da 0.005% zai zama de-wetting.

8. Duba kusurwar siyar da igiyar ruwa, digiri 7 shine mafi kyau, kuma lebur yana da sauƙin rataye tin.

9. PCB hukumar nakasawa, wannan halin da ake ciki zai kai ga PCB hagu tsakiyar dama uku matsa lamba zurfin rashin daidaito, da kuma lalacewa ta hanyar cin tin zurfin wuri tin ya kwarara ba santsi, sauki don samar da gada.

10. IC da jere na mummunan zane, an haɗa su tare, sassan hudu na IC m ƙafa tazarar <0.4mm, babu karkatar kwana a cikin jirgin.

11.pcb zafi tsakiyar nutse nakasawa lalacewa ta hanyar ko da tin.

12. PCB hukumar walda kwana, theoretically mafi girma da kwana, da solder gidajen abinci a cikin kalaman daga kalaman kafin da kuma bayan solder gidajen abinci daga kalaman lokacin da chances na kowa surface ne karami, da chances na gada ne kuma karami.Duk da haka, kusurwar soldering an ƙaddara ta hanyar wetting halaye na solder kanta.Gabaɗaya magana, kusurwar siyar da gubar yana daidaitawa tsakanin 4 ° da 9 ° dangane da ƙirar PCB, yayin da siyar da ba ta da gubar tana daidaitawa tsakanin 4 ° da 6° dangane da ƙirar PCB na abokin ciniki.Ya kamata a lura da cewa a cikin babban kusurwar tsarin walda, gaban ƙarshen PCB tsoma tin zai bayyana yana cin tin a cikin rashin tin akan halin da ake ciki, wanda zafi na PCB ya haifar da tsakiyar tsakiyar. da concave, idan irin wannan halin da ake ciki ya kamata ya dace don rage walda kwana.

13. tsakanin da'irar hukumar gammaye ba a tsara su tsayayya solder dam, bayan bugu a kan solder manna alaka;ko da'irar hukumar da kanta an ƙera don tsayayya solder dam / gada, amma a cikin ƙãre samfurin a cikin wani ɓangare ko duka kashe, sa'an nan kuma sauki ko da tin.

ND2+N8+T12


Lokacin aikawa: Nov-02-2022

Aiko mana da sakon ku: