I. Kushin ya zoba
1. Riko da pads (ban da saman manna pads) yana nufin cewa haɗuwa da ramukan, a cikin aikin hakowa zai haifar da raguwa saboda yawan hakowa a wuri guda, yana haifar da lalacewa ga ramin.
2. Multilayer jirgin a cikin ramuka biyu zoba, kamar rami don ware faifai, wani rami don haɗin faifai (flower pads), sabõda haka, bayan zana fitar da mummunan yi ga keɓewar faifai, sakamakon a datti.
II.Zagi na graphics Layer
1. A wasu nau'ikan zane-zane don yin haɗin da ba shi da amfani, asalin allo mai Layer huɗu amma an tsara fiye da yadudduka biyar na layin, ta yadda dalilin rashin fahimta.
2. Zane don adana lokaci, Protel software, alal misali, ga duk layin layi tare da Layer Layer don zana, da Layer Layer don karce layin lakabin, don haka lokacin da zana bayanan haske, saboda ba a zaɓi Layer Layer ba. rasa haɗin haɗi da karya, ko kuma za a ɗan gajeren lokaci saboda zaɓin Layer Layer na layin lakabin, don haka zane don kiyaye mutuncin zane-zane da tsabta.
3. Against na al'ada zane, kamar bangaren surface zane a cikin Bottom Layer, waldi surface zane a cikin Top, haifar da rashin jin daɗi.
III.Halin sanya rudani
1. The hali cover gammaye SMD solder lug, zuwa buga jirgin ta hanyar gwajin da kuma bangaren walda rashin jin daɗi.
2. Tsarin halayen ya yi ƙanƙanta, yana haifar da matsaloli a cikinna'urar firintar allobugu, da girma da yawa don sa haruffan su mamaye juna, da wuyar rarrabewa.
IV.Saitunan buɗewar kushin mai gefe guda
1. Gabaɗaya ba a haƙa maƙallan gefe guda ɗaya, idan ramin yana buƙatar alama, yakamata a tsara buɗewarsa zuwa sifili.Idan an tsara darajar ta yadda lokacin da aka samar da bayanan hakowa, wannan matsayi ya bayyana a cikin ramukan ramuka, da matsala.
2. Pads mai gefe guda kamar hakowa ya kamata a yi alama ta musamman.
V. Tare da shingen cikawa don zana mashin
Tare da filler toshe zane kushin a cikin zane na layin iya wuce da DRC rajistan shiga, amma ga aiki ba zai yiwu ba, don haka azuzuwan kushin ba zai iya kai tsaye samar da solder tsayayya data, a lokacin da a kan solder tsayayya, filler block yankin za a rufe da mai siyarwar ya ƙi, yana haifar da matsalolin siyarwar na'urar.
VI.Layin ƙasan lantarki shima fulawa ne kuma an haɗa shi da layi
Domin samar da wutar lantarki da aka tsara a matsayin hanyar furen fure, Layer na ƙasa da ainihin hoton da ke kan allon da aka buga shi ne akasin haka, duk layin da aka haɗa shi ne keɓaɓɓen layi, wanda mai zane ya kamata ya bayyana sosai.A nan ta hanyar, zana ƙungiyoyin wutar lantarki da dama ko kuma layin keɓewar ƙasa da yawa ya kamata a yi taka tsantsan don kada a bar wani gibi, ta yadda ƙungiyoyin biyu na wutar lantarki ba su da iyaka, kuma ba za su iya haifar da toshe haɗin yankin ba (ta yadda ƙungiyar ta kasance. iko ya rabu).
VII.Ba a bayyana matakin sarrafawa ba a sarari
1. Ƙirar panel guda ɗaya a cikin TOP Layer, kamar rashin ƙara bayanin abin da ke da kyau da kuma mummunan aiki, watakila an yi shi daga allon da aka ɗora akan na'urar kuma ba mai kyau waldi ba.
2. alal misali, ƙirar allo mai layi huɗu ta amfani da TOP mid1, tsakiyar 2 ƙasa huɗu, amma ba a sanya aiki a cikin wannan tsari ba, wanda ke buƙatar umarni.
VIII.Zane-zanen toshe mai cikawa da yawa ko toshe mai cikawa tare da cikar layi na bakin ciki sosai
1. Akwai asarar bayanan zanen haske da aka samar, bayanan zanen haske bai cika ba.
2. Domin ana amfani da shingen cikawa a cikin sarrafa bayanan zana haske layi ta layi don zana, don haka adadin bayanan zana hasken da aka samar yana da yawa, yana ƙara wahalar sarrafa bayanai.
IX.Kushin na'ura mai hawa saman ya yi gajeru sosai
Wannan shi ne ta hanyar da kuma ta hanyar gwaji, don ma m surface Dutsen na'urar, da tazara tsakanin ta biyu ƙafãfunsa ne quite kananan, da kushin ne quite sirara, shigarwa gwajin allura, dole ne sama da ƙasa (hagu da dama) staggered matsayi, kamar ƙirar kushin yana da ɗan gajeren gajere, kodayake baya shafar shigarwar na'urar, amma zai sa allurar gwajin kuskure ba ta buɗe matsayi ba.
X. Tazarar grid mai girma ya yi ƙanƙanta sosai
Haɗin babban layin grid na yanki tare da layin tsakanin gefen yana da ƙananan ƙananan (kasa da 0.3mm), a cikin tsarin masana'antu na kwamitocin da aka buga, tsarin canja wurin adadi bayan haɓakar inuwa yana da sauƙi don samar da fim mai yawa. a haɗe zuwa allon, yana haifar da karya layi.
XI.Babban yanki na jan karfe daga firam na waje na nesa ya yi kusa sosai
Babban yanki na jan ƙarfe daga firam ɗin waje ya kamata ya zama aƙalla tazara na 0.2mm, saboda a cikin siffar niƙa, kamar niƙa zuwa foil ɗin tagulla yana da sauƙi don haifar da ɓarna na jan ƙarfe kuma ya haifar da matsalar juriya na solder kashe.
XII.Siffar ƙirar iyakar ba ta bayyana ba
Wasu abokan ciniki a cikin Keep Layer, Board Layer, Top over Layer, da dai sauransu an tsara layin siffa kuma waɗannan layukan siffa ba su zoba, wanda ke haifar da pcb masana'antun da wahala don sanin wane layin siffar zai yi nasara.
XIII.Tsarin zane mara daidaituwa
Rashin daidaituwa Layer lokacin plating graphics yana rinjayar inganci.
XIV.Wurin shimfiɗar tagulla ya yi girma sosai lokacin da ake amfani da layukan grid, don guje wa ƙumburi na SMT.
Lokacin aikawa: Janairu-07-2022