Yawancin nau'ikan nau'ikan da ake amfani da su don PCBs, amma an raba su zuwa kashi biyu, wato kayan da ake amfani da su na inorganic da kuma kayan maye.
Inorganic substrate kayan
Inorganic substrate yafi yumbu faranti, yumbu kewaye substrate abu ne 96% alumina, a cikin hali na bukatar wani babban ƙarfi substrate, 99% tsarki alumina abu za a iya amfani da amma high-tsarki alumina aiki matsaloli, yawan amfanin ƙasa ne low, don haka amfani da tsantsar alumina farashin yana da yawa.Beryllium oxide kuma abu ne na yumbu substrate, shi ne karfe oxide, yana da kyau lantarki rufi Properties da kuma m thermal watsin, za a iya amfani da a matsayin substrate ga high ikon yawa da'irori.
yumbu kewaye substrates aka yafi amfani a lokacin farin ciki da kuma bakin ciki fim matasan hadedde da'irori, Multi-guntu micro-taruwa da'irori, wanda suna da abũbuwan amfãni cewa Organic abu kewaye substrates ba zai iya daidaita.Alal misali, CTE na yumbu kewaye substrate zai iya daidaita da CTE na LCCC gidaje, don haka mai kyau solder aminci hadin gwiwa za a samu lokacin hada LCCC na'urorin.Bugu da kari, yumbu substrates sun dace da tsarin fitar da iska a masana'antar guntu saboda ba sa fitar da iskar gas mai yawa wanda ke haifar da raguwar matakin injin koda lokacin zafi.Bugu da kari, yumbu substrates kuma suna da high zafin jiki juriya, mai kyau surface gama, high sinadaran kwanciyar hankali, shi ne fĩfĩta kewaye substrate for lokacin farin ciki da bakin ciki film matasan da'irori da Multi-guntu micro-taro da'irori.Duk da haka, yana da wuya a aiwatar a cikin babban da lebur substrate, kuma ba za a iya sanya a cikin Multi-yanki hade hatimi hukumar tsarin saduwa da bukatun da sarrafa kansa samar Bugu da kari, saboda da manyan dielectric akai na yumbu kayan, don haka shi Har ila yau, bai dace da ma'auni mai sauri ba, kuma farashin yana da girma.
Organic substrate kayan
Ana yin kayan da ake amfani da su ne da kayan ƙarfafawa kamar gilashin fiber zane (takardar fiber, tabarma ta gilashi, da sauransu), wanda aka yi da shi tare da daure mai gudu, a bushe a cikin sarari, sa'an nan an rufe shi da foil na jan karfe, kuma ana yin shi ta hanyar zafin jiki da matsa lamba.Ana kiran irin wannan nau'in substrate na jan karfe-clad laminate (CCL), wanda aka fi sani da nau'in panel na jan karfe, shine babban kayan kera PCBs.
CCL iri-iri da yawa, idan kayan ƙarfafawa da aka yi amfani da su don rarraba, za a iya raba su zuwa tushen takarda, tushen zanen fiber gilashi, tushe mai hade (CEM) da nau'ikan tushen ƙarfe huɗu;bisa ga mai ɗaure resin kwayoyin halitta da aka yi amfani da shi don rarraba, kuma ana iya raba shi zuwa resin phenolic (PE) epoxy resin (EP), resin polyimide (PI), polytetrafluoroethylene resin (TF) da polyphenylene ether resin (PPO);idan substrate yana da tsauri kuma mai sauƙi don rarraba, kuma za'a iya raba shi zuwa CCL mai tsauri da CCL mai sauƙi.
A halin yanzu yadu amfani a samar da biyu-gefe PCB ne epoxy gilashin fiber kewaye substrate, wanda hadawa da abũbuwan amfãni daga mai kyau ƙarfin gilashin fiber da epoxy guduro tauri, tare da mai kyau ƙarfi da kuma ductility.
Epoxy gilashin fiber kewaye substrate an yi shi ta hanyar fara shigar da resin epoxy a cikin zanen fiber gilashin don yin laminate.A lokaci guda kuma, ana ƙara wasu sinadarai, kamar su curing agents, stabilizers, anti-flammability agents, adhesives, da dai sauransu, sannan a liƙa foil ɗin tagulla a manne a gefe ɗaya ko biyu na laminate ɗin don yin fiber na gilashin epoxy mai sanye da tagulla. laminate.Ana iya amfani da shi don yin PCB masu gefe guda, mai gefe biyu da multilayer iri-iri.
Lokacin aikawa: Maris-04-2022