Bukatun ƙira na PCBA Thermal Pads

1. Menene thermal pad

Abin da ake kira thermal pads, yana nufin kasan abubuwan da aka haɗa tare da gefen karfe na pads na zubar da zafi na zafi, yawanci ƙananan ƙarfin wuta, musamman ta hanyar daɗaɗɗen zafi a kan ramukan zubar da zafi zuwa ƙasa Layer.Domin mafi kyau zafi dissipation, wani lokacin bukatar zana zafi nutse rami domin ta-rami (ba toshe rami), sabõda haka, reflow soldering narkakkar solder zai gudana zuwa baya, da samuwar kwano beads, ta haka rinjayar solder manna bugu a kan. saman beads.

2. Bukatun ƙira

(1) Domin rage abin da ya faru na kwano beads, da rami za a iya tsara don diamita na ≤ 0.30mm ko ≥ 0.80mm rami;Hakanan za'a iya amfani da ƙira ta resin plug rami surface plating (POFV).

(2) A jera duk ma'aunin zafin rana akan farfajiyar saida ta biyu don yarda da kasancewar kwano.

(3) Zana Layer tsari na thermal.Idan kauri na allon PCB <2.4mm, da adadin yadudduka na ƙasa da ke da alaƙa da ramin ramin zafin rana

SiffofinNeoDen IN12C sake kwarara tanda

1. Gina-in waldi tsarin tacewa hayaki, m tacewa na cutarwa gas, da kyau bayyanar da muhalli kariya, more a layi tare da yin amfani da high-karshen yanayi.

2. Tsarin sarrafawa yana da halaye na haɗin kai mai girma, amsawar lokaci, ƙananan rashin nasara, kulawa mai sauƙi, da dai sauransu.

3. Na musamman dumama module zane, tare da high madaidaicin zafin jiki kula, uniform zazzabi rarraba a thermal ramuwa yankin, high dace da thermal ramuwa, low ikon amfani da sauran halaye.

4. kyakkyawa kuma yana da aikin ƙararrawa ja, rawaya da kore na ƙirar ƙira.

5. Motar motar da aka haɓaka ta al'ada bisa ga halaye na bel ɗin raga na nau'in B, don tabbatar da saurin daidaituwa da tsawon rayuwa.

ND2+N10+AOI+IN12C


Lokacin aikawa: Nuwamba-15-2022

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