Wannan takarda tana ƙididdige wasu sharuɗɗan ƙwararrun gama gari da bayani don sarrafa layin taro naInjin SMT.
1. PCBA
Printed Circuit Board Assembly (PCBA) yana nufin tsarin da ake sarrafa allunan PCB da kera su, gami da bugu na SMT, Plugins na DIP, gwajin aiki, da Majalisar samfur ta gama.
2. PCB allon
Printed Circuit Board (PCB) ɗan gajeren lokaci ne na allon da'ira da aka buga, yawanci ana kasu kashi ɗaya, panel biyu da allo mai yawa.Abubuwan da aka fi amfani da su sun haɗa da FR-4, resin, gilashin fiber gilashi da substrate aluminum.
3. Fayilolin Gerber
Gerber fayil yafi bayyana tarin daftarin aiki format na PCB image (line Layer, solder juriya Layer, hali Layer, da dai sauransu) hakowa da milling data, wanda bukatar da za a bayar da PCBA sarrafa shuka a lokacin da PCBA zance da aka sanya.
4. Fayil na BOM
Fayil ɗin BOM shine jerin kayan.Duk kayan da aka yi amfani da su wajen sarrafa PCBA, gami da adadin kayan aiki da hanyar tsari, sune mahimman tushe don siyan kayan.Lokacin da aka nakalto PCBA, ana kuma buƙatar bayar da ita ga injin sarrafa PCBA.
5. SMT
SMT shine taƙaitaccen bayanin "Surface Dutsen Fasaha", wanda ke nufin aiwatar da bugu na solder manna, kayan haɓaka takarda da haɓakawa.reflow tandasoldering a kan PCB board.
6. Solder manna firinta
Buga mai siyar wani tsari ne na sanya man siyar a kan ragar karfe, da zubar da manna ta hanyar rami na gidan karfen ta hanyar gogewa, da buga man siyar daidai akan kushin PCB.
7. SPI
SPI mai gano kauri ne mai solder.Bayan bugu na manna solder, ana buƙatar gano SIP don gano yanayin bugu na manna mai siyarwa da sarrafa tasirin bugu na manna solder.
8. Sake walda
Reflow soldering shi ne a saka PCB manna a cikin reflow solder inji, da kuma ta wurin high zafin jiki a ciki, da manna solder manna za a mai tsanani cikin ruwa, kuma a karshe walda za a kammala ta sanyaya da kuma solidification.
9. AOI
AOI yana nufin ganowar gani ta atomatik.Ta hanyar kwatanta kwatancen, ana iya gano tasirin walda na hukumar PCB, kuma ana iya gano lahani na hukumar PCB.
10. Gyara
Ayyukan gyaran AOI ko allunan da aka gano da hannu.
11. DIP
DIP gajere ne don “Dual In-line Package”, wanda ke nufin fasahar sarrafa kayan da aka haɗa tare da fil a cikin allo na PCB, sannan sarrafa su ta hanyar sayar da igiyar igiya, yanke ƙafa, siyar da bayan gida, da wanke faranti.
12. Wave soldering
Wave soldering shine a saka PCB a cikin tanderun wutar lantarki, bayan feshi juyi, preheating, waldawar igiyar ruwa, sanyaya da sauran hanyoyin haɗin gwiwa don kammala waldawar allon PCB.
13. Yanke abubuwan da aka gyara
Yanke abubuwan da ke kan allo na PCB mai walda zuwa girman da ya dace.
14. Bayan sarrafa walda
Bayan sarrafa walda shine gyara walda da gyara PCB wanda bai cika walda ba bayan dubawa.
15. Wanke faranti
Allon wanki shine don tsaftace ragowar abubuwa masu cutarwa kamar juzu'i akan samfuran da aka gama na PCBA don saduwa da daidaitaccen tsabtar kare muhalli da abokan ciniki ke buƙata.
16. Guda uku anti fenti
Fenti guda uku na rigakafin fenti shine fesa wani Layer na shafi na musamman akan allon farashin PCBA.Bayan warkewa, zai iya kunna aikin rufin, tabbacin danshi, hujjar yabo, hujjar girgiza, hujjar kura, hujjar lalata, hujjar tsufa, hujjar mildew, sassan sassaka da juriya na corona.Yana iya tsawaita lokacin ajiya na PCBA da keɓance yashwar waje da ƙazanta.
17. Plate Welding
Juya shine saman PCB yana faɗaɗa jagorar gida, babu murfin fenti, za'a iya amfani dashi don abubuwan walda.
18. Encapsulation
Marufi yana nufin hanyar marufi na abubuwan da aka gyara, an raba marufi zuwa DIP sau biyu - layi da facin facin SMD biyu.
19. Pin tazara
Tazarar fil yana nufin nisa tsakanin tsakiyar layukan da ke kusa da bangaren hawa.
20. QFP
QFP gajere ne don “Quad Flat Pack”, wanda ke nufin haɗaɗɗen da'ira mai haɗaɗɗiyar ƙasa a cikin fakitin filastik na bakin ciki tare da gajeriyar jagororin iska ta bangarori huɗu.
Lokacin aikawa: Jul-09-2021