sarrafa PCBA ta hanyar ƙima shine ainihin samfurin daga tsarin da ya gabata zuwa tsari na gaba tsakanin lokacin da ake buƙata don cinyewa, sannan ƙarancin lokaci, mafi girman inganci, ƙimar yawan amfanin ƙasa, bayan haka, kawai lokacin da samfuran ku ba su da matsala. don kwarara zuwa mataki na gaba.Tare da wannan batu muna magana game da ƙarni na solder gidajen abinci a PCBA waldi ja tip da mafita:
1. PCB kewaye hukumar a preheating mataki zafin jiki ne ma low, preheating lokaci ne ma takaice, sabõda haka, da PCB da bangaren na'urar zafin jiki ne low, walda aka gyara da PCB zafi sha generated convex naushi hali.
2. SMT jeri walda zafin jiki ne ma low ko conveyor bel gudun ne da sauri, sabõda haka, danko na narkakkar solder ne ma girma.
3. electromagnetic famfo igiyar igiyar siyar da injin igiyar igiyar igiyar ruwa ta yi tsayi da yawa ko fil ɗin ya yi tsayi sosai, ta yadda kasan fil ɗin ba zai iya tuntuɓar kololuwar igiyar ba.Saboda na'urar siyar da famfo na lantarki mai raɗaɗi ne, kauri daga cikin raƙuman ruwa shine 4 ~ 5mm.
4. Rashin aikin motsa jiki.
5. DIP harsashi aka gyara gubar diamita da harsashi rami rabo ba daidai ba, harsashi rami ne ma babba, babban kushin zafi sha.
Abubuwan da ke sama sune mafi mahimmancin abubuwan da ke haifar da haɓakar haɗin gwiwa na solder, don haka dole ne mu yi daidaitaccen haɓakawa da daidaitawa ga matsalolin da ke sama a cikin sarrafa smt, don magance matsalar kafin ta faru, don tabbatar da yawan amfanin ƙasa da samfuran samfuran. gudun bayarwa.
1. Tin kalaman zafin jiki na 250 ℃ ± 5 ℃, lokacin walda 3 ~ 5s;zafin jiki ya ɗan ragu kaɗan, saurin bel ɗin isarwa don rage wasu.
2. tsayin igiyar ruwa ana sarrafa shi gabaɗaya a 2/3 na kauri na allon buga.Shigar fil ɗin da aka shigar yana buƙatar fitattun abubuwan da za a fallasa su ga bugu
3. Board soldering surface 0.8mm ~ 3mm.
4. Sauya juzu'i.
5. Ramin rami na rami na harsashi shine 0.15 ~ 0.4mm ya fi girma fiye da diamita na gubar (mai kyau gubar ɗaukar ƙananan layi, mai kauri mai kauri ya ɗauki iyakar babba).
Siffofin NeoDen IN6 Reflow Oven
1. Full convection, m soldering yi.
2. 6 zones zane, haske da m.
3. Smart iko da high ji zafin jiki firikwensin, da zazzabi za a iya stabilized a cikin + 0.2 ℃.
4. Original gina-in soldering hayaki tace tsarin, m bayyanar da muhalli-friendly.
5. Heat rufi kariya zane, da casing zafin jiki za a iya sarrafawa a cikin 40 ℃.
6. Samar da wutar lantarki na gida, dacewa da aiki.
Lokacin aikawa: Juni-20-2023